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Glue-dispensing positioning clamp and method for utilizing glue-dispensing positioning clamp to calibrate glue-dispensing needle head

A positioning fixture and dispensing technology, which is applied in the field of dispensing positioning fixtures to calibrate dispensing needles and dispensing positioning fixtures, can solve problems such as low distance accuracy, unsuitable solder paste size, and broken needles, so as to improve positioning accuracy. Effect

Inactive Publication Date: 2015-03-25
SHANGHAI AMPHENOL AIRWAVE COMM ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the positioning error of the dispensing positioning jig 20 relative to the workbench and the error of the object 10 relative to the dispensing positioning jig 20 will result in low accuracy of distance control
Low precision will result in either wrong solder paste size or crashed pins

Method used

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  • Glue-dispensing positioning clamp and method for utilizing glue-dispensing positioning clamp to calibrate glue-dispensing needle head
  • Glue-dispensing positioning clamp and method for utilizing glue-dispensing positioning clamp to calibrate glue-dispensing needle head
  • Glue-dispensing positioning clamp and method for utilizing glue-dispensing positioning clamp to calibrate glue-dispensing needle head

Examples

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Embodiment Construction

[0023] image 3 An exploded view of a dispensing positioning fixture according to an embodiment of the present invention is shown. Figure 4 A cross-sectional view of a dispensing positioning fixture according to an embodiment of the present invention is shown. refer to image 3 with Figure 4 As shown, the dispensing positioning fixture 100 of this embodiment includes an upper fixing plate 110 , a lower fixing plate 120 , a top block 130 , and an assembly pin 140 .

[0024] The upper fixing plate 110 has a flat plate 112 and two extensions 114 . The plate 112 has an upper surface A and a lower surface B. As shown in FIG. One or more through slots 113 can be disposed on the plate 112 . The two extensions 114 have the same number of perforations 115 , and these perforations 115 correspond one-to-one in horizontal position. In addition, the bottom surfaces of the two extension parts 114 jointly define a lower surface C, which is a horizontal positioning surface for placing...

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Abstract

The invention relates to a glue-dispensing positioning clamp and a method for utilizing the glue-dispensing positioning clamp to calibrate a glue-dispensing needle head, so as to increase the positioning precision of the glue-dispensing needle head. The glue-dispensing positioning clamp comprises an upper fixing plate, an ejecting block and an assembling structure, wherein the upper fixing plate is provided with a flat plate and two extending parts extending downward from the flat plate; a plurality of through slots are arranged on the flat plate; the lower surface of the flat plate is a first surface; a second surface is jointly defined by the bottom surfaces of the two extending parts; the second surface is parallel to the first surface; and a plurality of positioning slots for positioning a glue-dispensing object are arranged on the ejecting block. After the glue-dispensing object is placed, the ejecting block is placed under the first surface of the upper fixing plate and a glue-dispensing surface of the glue-dispensing object is adhered to the first surface. The assembling structure is used for fixing the ejecting block after the glue-dispensing object and the ejecting block are assembled onto the upper fixing plate in turn.

Description

technical field [0001] The invention relates to soldering electronic devices using Surface Mount Technology (SMT), in particular to a dispensing positioning jig and a method for calibrating dispensing needles using the dispensing positioning jig. Background technique [0002] Surface mount technology is a circuit assembly technology that pastes and solders surface mount components to specified positions on the surface of a printed circuit board. Specifically, the solder paste is first coated on the printed circuit board, and then the surface mount components are accurately placed on the pads coated with the solder paste, and the printed circuit board is heated until the solder paste melts and cooled. After that, the interconnection between the components and the printed board is realized. [0003] At present, the antennas of mobile phones or personal digital assistants (Personal Digital Assistant) require SMT soldering of electronic devices directly to the antennas of non-f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K37/04
Inventor 许春晖
Owner SHANGHAI AMPHENOL AIRWAVE COMM ELECTRONICS CO LTD
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