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Flexible packaging substrate and manufacturing method thereof

A flexible packaging and manufacturing method technology, applied in electrical components, electrical solid devices, circuits, etc., can solve problems affecting operation, stickiness, etc.

Active Publication Date: 2016-04-06
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the adhesive sheet is in a semi-cured state, it will be sticky during subsequent high-temperature baking, which will affect the operation

Method used

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  • Flexible packaging substrate and manufacturing method thereof
  • Flexible packaging substrate and manufacturing method thereof
  • Flexible packaging substrate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Production: First use epoxy resin composition, immerse 106 glass fiber cloth on the gluing machine, then pass through the oven of the gluing machine to obtain the semi-cured bonding sheet 10, and then bake the semi-cured bonding sheet 10 at 190℃ for 1.5 A fully cured adhesive sheet (called the cured sheet 11) is obtained in a few hours. One side of the cured sheet 11 and the adhesive film 12 are hot-pressed on the laminating machine, and then punched after hot pressing, and then the release film of the adhesive film 12 Removed and hot-pressed with electrolytic copper foil 13 to obtain figure 1 The flexible packaging substrate of the structure shown.

Embodiment 2

[0054] Production: First use epoxy resin composition to impregnate 1078 glass fiber cloth on the gluing machine, then pass through the oven of the gluing machine to obtain the semi-cured adhesive sheet 10, and then bake the semi-cured adhesive sheet 10 at 190℃ for 1.5 A fully cured adhesive sheet (called cured sheet 11) is obtained in a few hours. The two sides of the cured sheet 11 and the adhesive film 12 are hot-pressed on the laminating machine, and then punched, and then the release film of the adhesive film 12 It is removed and hot-pressed with the electrolytic copper foil 13. Get as figure 2 The structure shown is a flexible packaging substrate.

Embodiment 3

[0056] Production: First use epoxy resin composition, impregnate 1080 glass fiber cloth on the gluing machine, then pass through the oven of the gluing machine to obtain the semi-cured bonding sheet 10, and then bake the semi-cured bonding sheet 10 at 190℃ for 1.5 A fully cured adhesive sheet (called the cured sheet 11) is obtained in a few hours. One side of the cured sheet 11 and the adhesive film 12 are hot-pressed on the laminating machine, and then punched after hot pressing, and then the release film of the adhesive film 12 It is removed and hot-pressed with the rolled copper foil 13. Get as figure 1 The structure shown is a flexible packaging substrate.

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Abstract

The invention relates to a flexible encapsulating substrate, which comprises a curing sheet, a glue film and a copper foil laminated together, wherein the glue film is positioned between the curing sheet and the copper foil; and the glue film and the curing sheet are provided with through holes. According to the flexible encapsulating substrate, the cured curing sheet is laminated with the flue film, so that bonding is avoided during subsequent high-temperature baking when a smart card is taken as the encapsulating substrate, and the operation is not influenced. The invention further relates to a manufacturing method for the flexible encapsulating substrate.

Description

Technical field [0001] The invention relates to the field of smart card production, in particular to a flexible packaging substrate used for smart card packaging and a manufacturing method thereof. Background technique [0002] Smart cards have shown advantages in more and more fields. Their high reliability and the characteristics of not easily losing information will gradually replace magnetic cards in many occasions, such as bank cards and social security cards. [0003] The smart card production process requires a chip packaging step (ie, IC packaging), and the PCB used to carry the chip is the packaging carrier. The production of the package carrier can be a panel-panel (ie, one-by-one packaging) process or a roll-roll (ie, roll-to-roll packaging) process, and the latter undoubtedly has higher production efficiency. The substrate used in the roll-roll process is the flexible substrate. [0004] Flexible substrates can bring many applications: [0005] 1. Internal wire bonding: ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/14
Inventor 汪青
Owner GUANGDONG SHENGYI SCI TECH
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