Electronic equipment and heat radiation device thereof

A technology for electronic equipment and electronic components, applied in the field of heat dissipation devices with windshields, can solve problems such as poor reliability of fans, deterioration of heat dissipation conditions of electronic equipment, failure of a single fan, etc.

Active Publication Date: 2012-07-04
3D NEW CULTURE CO LTD NINGBO CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with other heat dissipation devices such as radiators, the reliability of fans is poor, and there are often cases where a single fan in a fan module fails
The part where a single fan fails will cause the phenomenon of air flow backflow due to the loss of air pressure, which will cause the cooling air flow

Method used

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  • Electronic equipment and heat radiation device thereof
  • Electronic equipment and heat radiation device thereof
  • Electronic equipment and heat radiation device thereof

Examples

Experimental program
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Embodiment Construction

[0031] Please refer to figure 1 The electronic device in one embodiment of the present invention may be a server or the like, which includes a housing 10 , a plurality of heat-generating electronic components 20 disposed in the housing 10 and a heat dissipation device 30 disposed on the housing 10 . The casing 10 includes a first side wall 11 , a second side wall 12 , a top plate, a bottom plate (not shown in the figure), and other boards. These boards form a storage space for accommodating components such as heating electronic components 20 . Only the first and second side walls 11 and 12 are shown in the figure, and it can be understood that a plurality of side walls may also be included to separate a plurality of different accommodation spaces. A flow channel 40 for air flow is formed between the first and second side walls 11 and 12 .

[0032] The casing 10 also includes a circuit board 13 on which the heating electronic component 20 is arranged. At the same time, a numb...

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PUM

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Abstract

The invention relates to electronic equipment which comprises a shell, a circuit board placed inside the shell, a heating electronic element on the circuit board, and a heat radiation device arranged at one end of the shell, wherein the heat radiation device comprises a fan module and a fixing rack for fixing the fan module on the shell; the shell comprises a first sidewall and a second sidewall which are oppositely arranged, and a flow channel is formed between the first sidewall and the second sidewall; the heating electronic element is located in the flow channel; the fan module comprises a first fan and a second fan which are arranged side by side; the fixing rack is used for fixing the fan module at one ends of the first sidewall and the second sidewall; and a first through hole and a second through hole which are respectively corresponding to the first fan and the second are formed on the fixing rack, and the gas flows of the first fan and the second fan can pass through the first through hole and the second through hole so as to enter the flow channel. The electronic equipment also comprises a windshield which is rotatably connected to the fixing rack, wherein the windshield rotates around the fixing rack and shields the through hole corresponding to the fan in a non-operation state so as to avoid backflow at the position when any one of the first fan and the second fan is in a non-operation state.

Description

technical field [0001] The invention relates to an electronic device and a heat dissipation device arranged in the electronic device, in particular to a heat dissipation device with a windshield. Background technique [0002] The power and calorific value of existing electronic devices such as servers have risen sharply, so the heat dissipation requirements are also getting higher and higher. These electronic devices are generally equipped with a fan module to provide forced cooling airflow to cool the heat-generating electronic components in the electronic device. Compared with other heat dissipation devices such as heat sinks, the reliability of the fan is poor, and a single fan in a fan module often fails. And the part where a single fan fails will cause the phenomenon of air flow backflow due to the loss of air pressure, thus causing the cooling air flow to fail to flow in a predetermined direction. As a result, the heated electronic components cannot be cooled effecti...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 赖昱嘉
Owner 3D NEW CULTURE CO LTD NINGBO CHINA
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