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Circuit board and manufacturing method thereof

A production method and circuit board technology, which is applied in the direction of multilayer circuit manufacturing, printed circuit components, and electrical connection formation of printed components, can solve the problems of increased volume and inability to meet the reduction of product size, and achieve the effect of volume reduction

Active Publication Date: 2015-09-09
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, after the electronic components and heat sink are assembled on the circuit board, the volume of the product also increases, so it cannot meet the current demand for reducing the size of the product

Method used

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  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

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Embodiment Construction

[0054] Figure 1A to Figure 1E It is a schematic cross-sectional view of a manufacturing process of a circuit board according to an embodiment of the present invention. First, please refer to Figure 1A , providing an inner layer substrate 100 . The inner substrate 100 has a first surface 100a and a second surface 100b. The first surface 100a is opposite to the second surface 100b, and the second surface 100b has a region to be removed 100c. The inner substrate 100 includes a core layer 102 , a first surface circuit 104 , a second surface circuit 106 and an interconnect structure 108 . The core layer 102 is, for example, a dielectric layer. The first surface circuit 104 and the second surface circuit 106 are respectively disposed on opposite sides of the core layer 102 . The first surface circuit 104 and the second surface circuit 106 are electrically connected, for example, through an interconnection structure 108 in the core layer 102 . The material of the first surface...

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PUM

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Abstract

The invention discloses a circuit board and a manufacturing method thereof. The circuit board comprises an inner base plate, a first circuit structure, a plurality of through-holes and a second circuit structure, wherein the inner base plate is provided with a first surface and a second surface opposite to the first surface; the first circuit structure is equipped on the first surface; the through-holes are formed in the inner base plate and the first circuit structure; the second circuit structure is equipped on the second surface; the second circuit structure is provided with a cavity exposing out of the second surface and the through-holes, and at least one through-hole exposed by the cavity projects from the second surface.

Description

technical field [0001] The invention relates to a circuit board and its manufacturing method, and in particular to a circuit board with a cavity for accommodating heat sinks and its manufacturing method. Background technique [0002] In recent years, with the rapid development of electronic technology and the emergence of high-tech electronic industries, electronic products with more humanization and better functions are constantly being introduced, and are designed towards the trend of light, thin, short and small. These electronic products are usually equipped with circuit boards for mounting electronic components thereon. [0003] With the improvement of technology, the performance of the electronic components mounted on the circuit board is getting stronger and stronger, so the demand for heat dissipation is also getting higher and higher. In order to achieve the purpose of heat dissipation, the heat sink is generally installed directly on the electronic components, or ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/40H05K3/46
Inventor 张钦崇吴明豪
Owner UNIMICRON TECH CORP