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Electron device and manufacturing method for casing thereof

A technology of electronic device and manufacturing method, which is applied in the direction of electrical equipment shell/cabinet/drawer, telephone communication, electrical components, etc., can solve the problems of affecting the appearance and increasing the volume of electronic devices, etc.

Inactive Publication Date: 2012-07-11
FU TAI HUA IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of an external impact buffer device will increase the size of the electronic device and affect the appearance

Method used

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  • Electron device and manufacturing method for casing thereof
  • Electron device and manufacturing method for casing thereof
  • Electron device and manufacturing method for casing thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] see figure 1 and figure 2 , the electronic device 100 according to the embodiment of the present invention may be a touch panel computer, a mobile phone, an MP3 player, a digital photo frame, a liquid crystal display, and the like. In this embodiment, a touch-type tablet computer is taken as an example for description. The electronic device 100 includes a casing 10 and a display screen 30 fixedly mounted on the casing 10 . The electronic device 100 also includes various functional modules for realizing various corresponding functions. However, in order to save space, in this embodiment, the case 10 of the electronic device 100 and the display screen 30 fixed on the case 10 are mainly introduced. .

[0028] Please also see image 3 , the housing 10 is roughly square, and includes a bottom wall 11 , a peripheral wall 12 , a support wall 13 and a protection portion 14 integrally formed. The peripheral wall 12 is formed extending from the edge of the bottom wall 11 to...

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PUM

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Abstract

An electron device comprises a casing. The casing comprises a bottom wall, a peripheral wall extending from the bottom wall to one side, a supporting wall extending from the edge at one end of the bottom wall far away the peripheral wall to the center of the bottom wall, and protective parts, wherein the peripheral wall comprises a plurality of lateral walls connected in sequence; the protective parts are integrally formed at the joints of each two adjacent lateral walls, and the protective parts are fixedly connected with the bottom wall and the supporting wall. The invention also provides a manufacturing method for the casing of the electron device. When the electron device accidentally falls down or is impacted by an external force, the protective parts at the joints of the lateral walls of the casing can well protect the corner parts of the casing; and besides, the protective parts have a simple structure and a small size, and the appearance of the electron device cannot be affected since the protective parts are arranged in the casing.

Description

technical field [0001] The invention relates to a manufacturing method of an electronic device and its casing. Background technique [0002] The housing of the electronic device generally includes a bottom case and an upper case fixedly connected with the bottom case. The bottom shell and the upper shell are generally fixedly connected by means of welding, gluing or mechanical snapping. However, since the electronic device will inevitably be impacted or accidentally dropped during use, its anti-drop performance is particularly important. The structural strength of this assembled housing is poor, and the anti-drop performance is not good, which affects the durability of the electronic device. When the electronic device is accidentally dropped, the corners of the electronic device are fragile areas. In order to protect the corners of the electronic device, a common electronic device usually adopts an impact buffer device to protect the corners. The impact buffer device inc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00G06F1/16B23P15/00
CPCG06F1/1656G06F1/16H04M1/0266H04M1/18H04M1/0202Y10T29/49989
Inventor 石发光袁精华
Owner FU TAI HUA IND SHENZHEN