Unlock instant, AI-driven research and patent intelligence for your innovation.

Pattern matching method, pattern matching program, electronic computer, and electronic device testing apparatus

A matching method and technology of electronic equipment, applied in computing, measuring device, image enhancement and other directions, can solve problems such as difficulty in setting search benchmarks, difficulty in searching checkpoints, etc., and achieve the effect of simplifying setting operations

Inactive Publication Date: 2012-07-11
HITACHI HIGH-TECH CORP
View PDF2 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] In the technique disclosed in Patent Document 2, if a part of the point-symmetrical pattern used as a reference for searching an inspection point exists outside the range of the imaging screen, it is difficult to set a search reference, and thus it becomes difficult to accurately search for an inspection point.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Pattern matching method, pattern matching program, electronic computer, and electronic device testing apparatus
  • Pattern matching method, pattern matching program, electronic computer, and electronic device testing apparatus
  • Pattern matching method, pattern matching program, electronic computer, and electronic device testing apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0039] figure 1 It is a flowchart illustrating the procedure of the pattern matching method according to Embodiment 1 of the present invention.

[0040] figure 1 The procedure shown in the flow chart of the figure shows a method of pattern matching used in which an electronic device is photographed by an imaging device such as an optical microscope, and an inspection point is inspected using the photographed image. In this process, the above-mentioned photographed image can be received and executed by a computer or the like that executes the same procedure. The same applies to the following embodiments.

[0041] The term "electronic equipment" here refers to devices such as semiconductor devices to be inspected.

[0042] This electronic computer includes an arithmetic unit, a captured image input unit, an image display unit, and an operation input unit.

[0043] The computing device is composed of a CPU (Central Processing Unit) or a microcomputer, etc., and executes figu...

Embodiment approach 2

[0097] In Embodiment 2 of the present invention, a method for improving the effect of pattern matching will be described excluding elements that adversely affect the matching score of pattern matching. In addition, the method described in Embodiment 2 may be used in combination with the method described in Embodiment 1 or may be performed independently.

[0098] As an example of a captured image including elements that adversely affect the matching score of pattern matching, the figure 2 captured image. In this image, besides the scribed line 203, there is also a rectangular pattern.

[0099] Such patterns other than dashed lines affect the matching score when searching for point-symmetrical patterns by pattern matching, so it is preferable to remove them if possible.

[0100] Hereinafter, a method of searching for a point-symmetrical pattern after removing such a pattern that affects the matching score from the captured image will be described.

[0101] In addition, in th...

Embodiment approach 3

[0141] In Embodiment 3 of the present invention, a pattern matching method in which a reference image to be used for pattern matching can be selected by an inspector or the like will be described. In addition, conditions for optimizing pattern matching in accordance with the selected reference image will be described.

[0142] In addition, in the third embodiment, an effort is made to make the examiner who is used to the conventional pattern matching method unaware of the difference in the pattern matching method. Specifically, when the computing device reports the pattern matching result, it executes a process of correcting the report format in accordance with the existing pattern matching method. Details will be described later.

[0143] Figure 10 It is a flowchart illustrating the procedure of the pattern matching method according to the third embodiment. Figure 10 The procedures shown in the flow charts of FIG. Below, explain Figure 10 each step.

[0144] ( Figu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed is a pattern matching method whereby it is possible to accurately search testing points while saving effort of the work of presetting. An image region serving as a part of a captured image is retrieved, and a divisional image of the image region is set as a template image. Pattern matching is performed by rotating the template image. Moreover, it is determined whether or not point-symmetric patterns exist in the image region by the pattern matching.

Description

technical field [0001] The present invention relates to a pattern matching method for searching inspection points for circuit pattern inspection of electronic equipment, a program thereof, an electronic computer for executing the method, and an electronic equipment inspection apparatus provided with the electronic computer. Background technique [0002] In recent years, high-density integration of semiconductor devices for the purpose of improving the performance of semiconductor devices and reducing manufacturing costs has been progressing. In order to inspect such semiconductor devices, a semiconductor inspection device or a semiconductor measurement device utilizing an optical microscope or an electron microscope is used. [0003] These devices are equipped with a pattern matching mechanism for searching for a pattern for inspection purposes or a pattern for specifying an inspection point from a captured image of the electronic device as a mechanism for accurately capturi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06T7/00G01N21/956G06T1/00G06T7/60
CPCG01N21/95607G06T2207/30148G06T7/001G01N21/956G06T7/00
Inventor 丰田康隆池田光二安部雄一
Owner HITACHI HIGH-TECH CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com