Electronic paper unit and method for fabricating electronic paper unit
A production method and technology of electronic paper, applied in the direction of manufacturing tools, instruments, laser welding equipment, etc., can solve the problems that the glass substrate process cannot be fully applied, and achieve the reduction of water vapor intrusion into the electronic ink layer, the best durability, and the reduction of air bubbles Effect
Active Publication Date: 2012-09-05
E INK HLDG INC
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Problems solved by technology
[0003] However, flexible substrates have many limitations of their own materials, so they cannot be fully applied to the current glass substrate technology
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[0074] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:
[0075] figure 1 is a schematic diagram of an electronic paper unit according to an embodiment of the present invention. Please refer to figure 1, in this embodiment, the electronic paper unit 100 may include a flexible substrate 110 , a thin film transistor layer 120 , an electronic ink layer 130 , an adhesive layer 140 , a waterproof layer 150 and a frame glue 160 . The flexible substrate 110 may be a film substrate made of polyimide. The TFT layer 120 is disposed on the flexible substrate 110 . The electronic ink layer 130 is disposed on a surface S1 of the thin film transistor layer 120, wherein the electronic ink layer 130 and the thin film transistor layer 120 can be connected together by an adhesive layer 140, and the electronic ink layer 130 can be an electrophoretic (Electro Phoretic, EP) shows a thin film, and the...
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Abstract
The invention provides an electronic paper unit and a method for fabricating the electronic paper unit. The electronic paper unit includes a flexible substrate, a thin-film-transistor layer, an electronic ink layer, a waterproof layer, and a sealant. The thin-film-transistor layer is disposed on the flexible substrate. The electronic ink layer is disposed on a surface of the thin-film-transistor layer. The waterproof layer is disposed on the electronic ink layer. An edge surface of the waterproof layer and an edge surface of the electronic ink layer form a side wall where there is an acute angle or an obtuse angle between the side wall and the surface. The sealant is coated and covered on the side wall and the surface. The method for fabricating the electronic paper unit comprises steps of providing a hard substrate; disposing a flexible substrate, a thin-film-transistor layer, an electronic ink layer, and a waterproof layer on the hard substrate sequentially to form an electronic paper array; cutting the electronic paper array to form a plurality of electronic paper units; coating and curing the sealant at the periphery of the electronic paper unit; and taking down the electronic paper units from the hard substrate.
Description
technical field [0001] The invention relates to an electronic paper and a manufacturing method thereof, in particular to an electronic paper unit and a manufacturing method of the electronic paper unit. Background technique [0002] In recent years, electronic paper (E-paper) and electronic book (E-book) are booming, and displays with lighter, thinner, and flexible features will become the main development trend in the future. [0003] However, the flexible substrate has many material limitations, so it cannot be fully applied to the current glass substrate technology. Therefore, how to improve the existing equipment so that it can be applied to the production of flexible substrates has become a problem to be solved by relevant personnel. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide an electronic paper unit with better durability. Another technical problem to be solved by the present invention is to provide ...
Claims
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IPC IPC(8): G02F1/167B23K26/38
Inventor 张展玮吴和虔彭佳添胡至仁
Owner E INK HLDG INC