Hot melt adhesive

A hot melt adhesive, molecular weight technology, applied in the direction of adhesive type, ester copolymer adhesive, etc., can solve the problems of many volatile components, pollute the environment, and fail to meet the requirements of use, and achieve no pollution and volatile matter. , High degree of automation, the effect of meeting the requirements of use

Active Publication Date: 2013-11-13
广州市豪特粘接材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional outsourcing PU, PVC and other synthetic materials are bonded with solvent glue, which has many defects such as volatile components and environmental pollution.
With the traditional hot melt adhesive, the heat resistance after bonding basically does not exceed 40°C, and it will cause layering (bubbling), which cannot meet the requirements for use.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] A hot-melt adhesive, the hot-melt adhesive includes the following components in mass percentage: 1 part of a copolymer of methyl methacrylate and butyl acrylate with a molecular weight of 80,000, methyl methacrylate accounts for 45%, and butyl acrylate Accounting for 55%, 70 parts of styrene butadiene isoprene block copolymer with molecular weight of 120000, 30 parts of rosin pentaerythritol ester, 5 parts of calcium carbonate; 5 parts of 2,6-di-tert-butyl p-cresol, molecular weight It is 5 parts of 3000 microcrystalline wax.

Embodiment 2

[0012] A kind of hot-melt adhesive, this hot-melt adhesive comprises the component of following mass percent: 70 parts of the copolymers of methyl methacrylate and butyl acrylate, methyl methacrylate accounts for 50%, butyl acrylate accounts for 50%, 1 part of styrene butadiene isoprene block copolymer, 40 parts of C9 petroleum resin, 10 parts of calcium carbonate; 10 parts of microcrystalline wax.

Embodiment 3

[0014] A kind of hot-melt adhesive, this hot-melt adhesive comprises the component of following mass percent: Molecular weight is 100000 the copolymer of methyl methacrylate and butyl acrylate 20 parts, methyl methacrylate accounts for 35%, butyl acrylate accounts for 65%, 50 parts of styrene butadiene isoprene block copolymer with molecular weight of 110000, 20 parts of C5 petroleum resin, 2 parts of calcium carbonate; 0.5 part of 2,6-di-tert-butyl-p-cresol, molecular weight of 4000 , 7 parts of microcrystalline wax with a melting point of 70°C.

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PUM

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Abstract

The invention discloses a hot melt adhesive and aims to provide the hot melt adhesive which can not be foamed or layered under the condition of high temperatures after being bonded; and the invention has the technical key points that the hot melt adhesive comprises the following components in parts by weight: 1-70 parts of methyl methacrylate-butyl acrylate copolymer,1-40 parts of styrene-butadiene-isoprene segmented copolymer, 1-40 parts of thickening agent, 1-10 parts of filling agent, 1-5 parts of stabilizing agent and 5-10 parts of wax; and the hot melt adhesive belongs to the technical field of colloid preparation.

Description

technical field [0001] The invention discloses a melt glue, specifically a sol suitable for high temperature conditions, and belongs to the technical field of colloid preparation. Background technique [0002] The metal glasses case needs to be covered with PU or PVC film to enhance the appearance and protection, and the inner layer is flocked. Traditional outsourcing PU, PVC and other synthetic materials are bonded with solvent glue, which has many defects such as volatile components and environmental pollution. However, with traditional hot melt adhesives, the heat resistance after bonding basically does not exceed 40°C, and it will cause layering (bubbling), which cannot meet the requirements for use. Contents of the invention [0003] In view of the above problems, the present invention discloses a hot melt adhesive that does not cause foaming and delamination under relatively high temperature conditions after lamination. [0004] The technical scheme of the prese...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J133/08C09J153/02C09J133/12
Inventor 刘道礼
Owner 广州市豪特粘接材料有限公司
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