Unlock instant, AI-driven research and patent intelligence for your innovation.

Light-emitting diode encapsulation structure and manufacturing method thereof

A technology of light-emitting diodes and packaging structures, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve problems such as increased costs, too large and limited space for reflective cups, etc.

Inactive Publication Date: 2012-10-31
ZHANJING TECH SHENZHEN +1
View PDF5 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the large space of the reflective cup, it is easy to use too much phosphor powder in the packaging material filled in it, but the phosphor powder that can be excited in the reflective cup is limited, which will cause waste of phosphor powder and increase the cost. In addition, too much phosphor will also shade the LED chip, resulting in low luminous efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light-emitting diode encapsulation structure and manufacturing method thereof
  • Light-emitting diode encapsulation structure and manufacturing method thereof
  • Light-emitting diode encapsulation structure and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0022] see figure 1 A light emitting diode package structure 10 provided in the first embodiment of the present invention includes a package base 100 , a package module 200 disposed on the package base 100 , and a transparent package layer 300 covering the package module 200 .

[0023] The package base 100 includes a top surface 110 and a bottom surface 120 , and a receiving cup 130 is formed from the top surface 110 along the direction of the bottom surface 120 . The accommodating cup 130 is used to provide accommodating space for the package module 200 and the transparent encapsulating layer 300 and to set the light field of the LED packaging structure 10. The inner surface of the accommodating cup 130 is an inclined surface, and the inclined surface is formed from The surface 110 extends toward the bottom surface 120 and inclines radially inward, so that the entire accommodating cup 130 is wide at the top and narrow at the bottom, forming a funnel shape. Preferably, the in...

Embodiment approach 2

[0036] see image 3The difference between the light-emitting diode package structure 20 provided in the second embodiment of the present invention and the light-emitting diode package structure 10 in the first embodiment is that the substrate 410 of the package module 400 includes an insulating layer 411 and is formed at intervals between them. The first conductive layer 412 and the second conductive layer 413 on the insulating layer 411 . The LED chip 220 is flip-chip disposed on the substrate 410 and is electrically connected to the first conductive layer 412 and the second conductive layer 413 . The phosphor layer 230 forms the surface of the substrate 410 and covers the LED chip 220 , and the first conductive layer 412 and the second conductive layer 413 are respectively exposed from two ends of the phosphor layer 230 . The insulating layer 411 of the package module 400 is fixed on the bottom surface of the housing cup 130 of the package base 100 by welding or bonding, an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a light-emitting diode encapsulation structure, which comprises an encapsulation base, wherein an accommodating cup is formed on the base, and a first electrode and a second electrode are respectively exposed at the bottom of the accommodating cup. The light-emitting diode encapsulation structure also comprises an encapsulation body module arranged in the accommodation cup and a transparent encapsulation layer filled in the accommodation cup and covering the encapsulation body module. The encapsulation body module comprises a substrate, a light-emitting diode chip arranged on the substrate and a phosphor powder layer enclosing the light-emitting diode chip. The substrate is provided with a first conducting layer and a second conducting layer, wherein the light-emitting diode chip is electrically connected with the first conducting layer and the second conducting layer; and the first conducting layer and the second conducting layer are respectively electrically connected with a first electrode and a second electrode of the encapsulation base. The light-emitting diode encapsulation structure provided by the invention has the beneficial effect that the consumption of phosphor powder can be reduced, compared with the traditional encapsulation structure in which a light-emitting diode chip is arranged in an accommodating cup and then the accommodating cup is filled with fluorescent material. The invention also provides a manufacturing method of the light-emitting diode encapsulation structure.

Description

technical field [0001] The invention relates to a light emitting diode packaging structure and a manufacturing method thereof. Background technique [0002] The existing LED packaging process is usually to place the LED chip on the base, inject the liquid packaging material into the reflective cup by means of injection, etc., fill the entire reflective cup and cover the LED chip, and then heat and solidify the liquid package material to form the encapsulation layer. However, due to the large space of the reflective cup, it is easy to use too much phosphor powder in the packaging material filled in it, but the phosphor powder that can be excited in the reflective cup is limited, which will cause waste of phosphor powder and increase the cost. In addition, too much fluorescent powder will also shade the LED chip, resulting in low luminous efficiency. Contents of the invention [0003] In view of this, it is necessary to provide a light emitting diode packaging structure an...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/52H01L33/00
Inventor 许时渊林厚德蔡明达
Owner ZHANJING TECH SHENZHEN