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Semiconductor examining device

An inspection device and semiconductor technology, applied in the fields of semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, electrical components, etc., can solve the problems of large inspection time, arrangement deviation, wrong contact, heat generation, etc., and increase the number of simultaneous measurements. , the effect of eliminating alignment bias

Inactive Publication Date: 2014-09-10
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] The present invention solves the above-mentioned conventional problems, and its object is to provide a semiconductor inspection device that eliminates the problem of incorrect contact caused by alignment deviations that occur when inspecting the light intensity of light-emitting elements in a state of stretching an adhesive sheet, which is extremely large. Problems of inspection time, problems of making terminals on the back side of components, problems of heat generation, problems of light emission on the back side, and more accurate inspection of light intensity that conforms to actual specifications can be effectively performed

Method used

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  • Semiconductor examining device
  • Semiconductor examining device
  • Semiconductor examining device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0083] figure 1 It is a schematic diagram for explaining the semiconductor inspection method using the semiconductor inspection device according to Embodiment 1 of the present invention.

[0084] exist figure 1 Among them, the semiconductor inspection apparatus 1 according to Embodiment 1 is provided with a plurality of tables 21, and includes: an index table 2 which functions as a circular index table member for moving the plurality of tables 21; To be mounted on the table top 21, the LED element chip 5 as a semiconductor chip is accommodated in the socket part and can be energized; the pickup 7 plays the role of the first transfer part, and the first transfer part will transfer the semiconductor chip to the semiconductor chip. One or a plurality of LED element chips 5 with a smaller number among the plurality of LED element chips 5 after the wafer 4 is sliced ​​is transferred to a smaller number among the plurality of stages 21 of the index table 2 . Each socket 6 on one...

Embodiment approach 2

[0123] In Embodiment 1 above, it is described that one or more (for example, two) LED element chips 5 are moved to the sockets 6 on each table surface 21 of the circular indexing workbench 2, thereby performing inspections sequentially or simultaneously. However, in this Embodiment 2, it is described that more predetermined number of LED element chips 5 are simultaneously moved to a plurality of sockets 6 on each table surface 21A of the oblong index table 2A, thereby The cases where the inspections are carried out sequentially or simultaneously. In Embodiment 2, it is possible to better adapt to mass production.

[0124] Image 6 It is a schematic diagram for explaining the semiconductor inspection method using the semiconductor inspection apparatus according to Embodiment 2 of the present invention. In addition, in Image 6 in, for with figure 1 The components having the same function and effect are given the same component numbers for description.

[0125] exist Ima...

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Abstract

The present invention relates to a semiconductor inspection device that effectively performs more accurate light quantity inspection consistent with actual specifications. It has: an indexing table (2), which is provided with a plurality of tabletops (21) and moves the plurality of tabletops (21); a socket (6), which is mounted on the tabletop (21) and serves as a semiconductor chip for an LED element chip ( 5) It is housed inside and can be energized; the pickup (71) is used to slice one or more LEDs out of the plurality of LED element chips (5) that have been sliced ​​into the semiconductor wafer (4). The component chips (5) are transferred to each socket (6) on one or more tables (21) with a smaller number among the plurality of tabletops of the indexing table (2); and the inspection component is placed on one or more tabletops (21). One or more LED component chips (5) are mounted on a plurality of tabletops (21) and one or more LED component chips (5) are inspected.

Description

technical field [0001] The present invention relates to a semiconductor inspection device for inspecting the amount of emitted light and the like on inspection target devices such as light emitting elements such as LSI elements, LED elements, and laser elements. Background technique [0002] Conventionally, inspections of light-emitting elements such as LED elements and laser elements include DC inspection, light intensity inspection, and ESD inspection. Each component chip (chip) is performed separately. After slicing the element chip, the adhesive sheet is stretched to provide a gap between the element and adjacent elements, and each terminal of each element chip is contacted with a probe to perform light intensity inspection. In this way, around the LED element, stretch the adhesive sheet after slicing the wafer, so as to set a gap between the element and the adjacent element, and detect each element chip from the upper surface in the sheet state, so as to carry out the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01M11/02
CPCH01L21/67092H01L21/67144H01L22/30
Inventor 斋藤仁
Owner SHARP KK