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Component mounting device and component mounting method

A technology for installing devices and components, applied in the direction of electrical components, electrical components, robots, etc., can solve the problem of increasing the frequency of changing operations

Active Publication Date: 2016-03-02
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the component mounting system, as the type of the board as the work object is changed, the frequency of device type changing operations increases

Method used

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  • Component mounting device and component mounting method
  • Component mounting device and component mounting method
  • Component mounting device and component mounting method

Examples

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Embodiment Construction

[0038]Next, embodiments of the present invention will be described with reference to the drawings. First, refer to figure 1 and 2 The structure of the component mounting apparatus 1 will be described. exist figure 1 In the central part of the base 1a, the first board conveyance mechanism 2A and the second board conveyance mechanism 2B are provided in the X direction (the board conveyance direction), and the first board conveyance mechanism 2A and the second board conveyance mechanism 2B are directed in the X direction. The downstream side in the direction conveys the boards 4 respectively delivered from the upstream device. The first board conveying mechanism 2A and the second board conveying mechanism 2B each have a board supporting portion 3 , and the board supporting portion 3 positions and supports a board 4 conveyed from upstream at a mounting operation position according to a component mounting mechanism described below.

[0039] A first component supply section 5A a...

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PUM

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Abstract

The challenge to be met by the present invention is to provide a component mounting apparatus and a component mounting method that enable a component mounting apparatus including a plurality of mounting lines without stopping the operation of the mounting lines in the middle of production and without compromising the safety of the operator , to perform device type change operations as the board type changes. In the component mounting apparatus (1) having the first mounting line (L1) and the second mounting line (L2) and configured to be able to select the independent mounting mode or the alternate mounting mode, when the When performing a device type change operation while changing, if the tape feeder floating detection sensor (17) provided near the opening (19) through which a part of the body or foreign matter enters in the component supply section detects such as the operator Part of the body of the finger (26) or a foreign object stops the operation of the component mounting mechanism belonging to the installation line opposite to the installation line to which the component supply part in which the optical sensor is installed belongs.

Description

technical field [0001] The present invention relates to a component mounting device and a component mounting method for mounting electronic components on a board. Background technique [0002] An electronic component mounting system that manufactures a mounting board by mounting electronic components on a board is formed by combining a plurality of component mounting devices that mount electronic components on a board on which printed Paste for solder bonding. In recent years, in the electronics industry, along with the development of diversification of production modes, a production mode in which various types of products are manufactured in limited quantities is increasingly applied also in the field of component mounting. Therefore, in the component mounting system, as the type of the board as the work object is changed, the frequency of device type changing operations increases. For the purpose of improving productivity in the production field of component mounting, va...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
CPCH05K13/0857H05K13/0888Y10T29/4913Y10T29/53174Y10T29/49155Y10T29/49904Y10T29/49998Y10T29/53091Y10T29/5313Y10S901/20H05K13/04H05K13/0452
Inventor 北川贵之八木周藏川瀬健之
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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