Transparent multilayer board pasting device and method thereof for preventing liquid glue from overflowing

A laminating device and multi-layer board technology, which is applied in lamination devices, chemical instruments and methods, lamination, etc., can solve the problems that it is difficult to control the flow direction of liquid glue overflow, and achieve the effect of improving the process and quality

Inactive Publication Date: 2012-11-21
TPK TOUCH SOLUTIONS (XIAMEN) INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] From the above description, in the current process of using liquid glue as the bonding medium, it is not easy to control the flow direction of the liquid glue when it overflows and the time point when the glue overflows to each predetermined bonding boundary line.

Method used

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  • Transparent multilayer board pasting device and method thereof for preventing liquid glue from overflowing
  • Transparent multilayer board pasting device and method thereof for preventing liquid glue from overflowing
  • Transparent multilayer board pasting device and method thereof for preventing liquid glue from overflowing

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Embodiment Construction

[0016] The present invention uses the light source device to form light on the transparent multi-layer board in a circular scanning manner, so that the positions irradiated by the light can form a bonding boundary range. When the light-curable liquid adhesive is overflowing, the light-curable liquid adhesive that overflows to the bonding boundary can be formed and solidified immediately, so that it can simply and effectively prevent the light-curable liquid adhesive from overflowing the actual design of the paste The range of fit allows the transparent multilayer board to be evenly filled with light-curable liquid adhesive only within the range of the bonding boundary, improving the production quality of the transparent multilayer board.

[0017] In addition, it should be stated first that the transparent multilayer board referred to in the present invention refers to a structure composed of at least two layers of substrates that are essentially transparent, such as touch panel...

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Abstract

The present invention provides a transparent multilayer board pasting device, comprising a stitching mechanism and a light source unit. The stitching mechanism bears the weight of a first substrate and a second substrate of a transparent multilayer board, wherein the pasting surface of the first substrate and / or the pasting surface of the second substrate are coated with light-solidification liquid glue. The light source unit is arranged corresponding to the stitching mechanism, and irradiates a light on the transparent multilayer board, so that the irradiation position of the light forms a pasting boundary line. When the stitching mechanism stitches the first substrate and the second substrate to make the light-solidification liquid glue overflow, the light-solidification liquid glue from the overflow glue to the pasting boundary line is solidified. So the purpose of preventing light-solidification liquid glue from overflowing on pasting is achieved.

Description

technical field [0001] The invention relates to a laminating device for transparent multi-layer boards and a method for preventing liquid glue from overflowing, in particular to a laminating device for laminating transparent multi-layer boards using light-curable liquid glue and its method for laminating them. Liquid glue overflow method. Background technique [0002] In recent years, due to the increasingly mature development of liquid adhesives, more and more multi-layer board bonding processes have gradually adopted liquid adhesives as the bonding medium. For transparent multi-layer boards, light The use of solid liquid glue is the most common. However, since the liquid glue is prone to enveloping air bubbles and overflowing glue during the lamination process, relatively new or improved technologies are required in the lamination process and environment. [0003] In the bonding process of multi-layer boards, in order to avoid the situation that the liquid glue is prone ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B37/12B32B38/16B32B38/18B32B41/00
Inventor 李裕文许贤斌
Owner TPK TOUCH SOLUTIONS (XIAMEN) INC
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