Fiber-reinforced inorganic insulation board
An inorganic thermal insulation board and fiber-reinforced technology, applied in thermal insulation, building components and other directions, can solve the problems of easy cracking, unenvironmental protection, low strength of fireproof board, etc., and achieve the effect of not easy cracking and long service life.
Inactive Publication Date: 2012-12-12
周勇
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Problems solved by technology
[0002] The structural design of traditional insulation boards is relatively simple, and fireproof boards and metal plates are often used as panels. The fireproof boards have low strength and are easy to crack, and the metal plates are dense and easy to deform. In addition, the insulation layer generally uses organic insulation materials, which are not environmentally friendly and have good fireproof performance. Difference
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[0009] A fiber-reinforced inorganic thermal insulation board, including a body 1, the body 1 includes a surface layer 2 and a bottom layer 3 made of reinforced fiber cloth, which has high strength and is not easy to crack. Insulation granular layer 4, economical and environmentally friendly. The density of the body 1 is 200-300Kg / m 3 . The beneficial effect of the invention is that it is not easy to crack, economical and environment-friendly, and has a long service life.
[0010] Simple modifications and substitutions by those skilled in the art are within the protection scope of the present invention.
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Abstract
The invention discloses a fiber-reinforced inorganic insulation board which comprises a body (1). The body (1) comprises a surface layer made of reinforced fiber cloth, and a bottom layer. An inorganic insulation particle layer (4) is reserved between the surface layer (2) and the bottom layer (3). Density of the body (1) is 200-300kg / m<3>. The fiber-reinforced inorganic insulation board has the advantages that the insulation board cracks less easily and is economical, environment-friendly, and long in service life.
Description
technical field [0001] The invention relates to a thermal insulation board, in particular to an inorganic thermal insulation board. Background technique [0002] The structural design of traditional insulation boards is relatively simple, and fireproof boards and metal plates are often used as panels. The fireproof boards have low strength and are easy to crack, and the metal plates are dense and easy to deform. In addition, the insulation layer generally uses organic insulation materials, which are not environmentally friendly and have good fireproof performance. Difference. Contents of the invention [0003] Aiming at the shortcomings of the existing thermal insulation boards, the invention provides a novel fiber-reinforced inorganic thermal insulation board. [0004] In order to achieve the above object, the measures taken by the present invention: [0005] A fiber-reinforced inorganic heat-preservation board includes a body. The body includes a surface layer and a bo...
Claims
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IPC IPC(8): E04B1/80
Inventor 周勇
Owner 周勇