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A method for online detection of contact holes

A contact hole and self-aligned contact hole technology, applied in the field of wafer manufacturing, can solve the problems of wafer scrapping and low detection efficiency

Active Publication Date: 2015-10-28
CSMC TECH FAB2 CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method requires inspection of wafer slices, which leads to wafer scrapping
Moreover, this method does not belong to the online detection method, and its detection efficiency is low
In the prior art, there is no method for online detection of contact holes without damaging the wafer

Method used

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  • A method for online detection of contact holes
  • A method for online detection of contact holes
  • A method for online detection of contact holes

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Embodiment Construction

[0025] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0026] The invention measures the key dimension of the diameter of the inner ring of the top view image of the contact hole on the wafer surface by introducing a critical dimension scanning electron microscope (CD-SEM), and automatically judges whether there is a contact hole shape according to the inner diameter of the contact hole image obtained by measurement. abnormal defect.

[0027] Figure 2A and Figure 2B They are the top view photos and the corresponding cross-sectional photos of the wafer with abnormal contact hole shape defects obtained by scanning electron microscope (SEM). Such as Figure 2A and Figure 2B As shown, in the top-view photo of the contact hole on the wafer surface obtained by SEM, the top-view image of the contact hole includes an inner ring and an outer ring, which a...

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Abstract

The invention discloses an online contact hole detection method. The method includes: etching a self-alignment contact hole; determining a wafer detection area which is an area where the defect of shape abnormity of the contact hole possibly occur; using a CD-SEM (critical dimension- scanning electronic microscope) to measure the diameter of an inner ring of a contact hole bird's-eye view image in the detection area; and if the measured diameter of the inner ring is not within a preset range, prompting existence of the defect of shape abnormity of the contact hole by the CD-SEM. Using the online contact hole detection method can detect out the defect of shape abnormity of the contact hole without wafer discarding.

Description

technical field [0001] The invention relates to the technical field of wafer manufacturing, in particular to a method for online detection of contact holes. Background technique [0002] As the size of semiconductor devices decreases, the number of integrated devices per unit area increases, the density of devices increases, and the size of devices decreases, which leads to increasing manufacturing difficulties. Especially in the manufacture of semiconductor wafers for memory cells, the gap between the gates of the memory cells becomes very small, and the contact holes (Contact Via) connecting the source, drain and upper metal layer are made between the gates The process becomes more and more difficult. Therefore, the industry introduces self-aligned contact hole etching technology (Self-Aligned Contact Etch, SAC Etch) to manufacture contact holes, so as to realize the connection between the first metal layer (Medal-1) and the active region. Chinese patent application CN10...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
Inventor 李健杜哲牟亮伟
Owner CSMC TECH FAB2 CO LTD