Integrally molded die and bezel structure for fingerprint sensors and the like

A fingerprint sensor and sensor array technology, which can be used in the acquisition/organization of fingerprints/palmprints, instruments, electrical solid-state devices, etc., and can solve problems such as constraints
CN102844769AInactive Publication Date: 2012-12-26APPLE INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
APPLE INC
Publication Date
2012-12-26
Estimated Expiration
Not applicable · inactive patent

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Abstract

A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.
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Description

technical field

[0001] The present disclosure relates to integrated circuit packaging, and more particularly, to methods and apparatus for integrally molding a die and one or more slug structures for fingerprint sensors and the like, wherein the die and slug structures Parts of each are exposed or at best thinly covered. Background technique

[0002] One of the more common biometric sensing devices today is the fingerprint sensor. These devices control access to electronic devices such as computers and mobile phones, safes, buildings, vehicles, etc. by scanning a user's fingerprint and comparing it to a set of authenticated fingerprint images. Access may be granted if the provided fingerprint to be authenticated (as-taken) matches one of a set of pre-registered authorized fingerprints. The fingerprint sensor may be a standalone device, integrated into other devices such as PC peripherals, or may be integrated into the device through which the sensor controls access. The s...

Claims

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