Probing apparatus for semiconductor device

Abstract

The invention discloses a probing apparatus for a semiconductor device, comprising a primary circuit board and a signal-adapting board positioned on the primary circuit board. The primary circuit board includes an inner area having a plurality of first contacts and an outer area having a plurality of first terminals and second terminals, and the first contacts are electrically connected to the first terminals via first conductive members in the primary circuit board. The signal-adapting board includes a plurality of second contacts electrically connected to the first contacts via second conductive members in the signal-adapting board.

Description

technical field [0001] The present invention relates to a semiconductor device testing device, and in particular to a semiconductor device testing device having a basic circuit board and an auxiliary circuit board (such as a power board or a signal transfer board). Background technique [0002] Generally speaking, the electrical characteristics of the integrated circuit components on the wafer must be tested first to determine whether the integrated circuit components are good or not. Good ICs will be selected for subsequent packaging process, while defective ICs will be discarded to avoid additional packaging costs. The integrated circuit components that have been packaged must also undergo another electrical test to screen out packaged defective products, thereby improving the final product yield. [0003] There are two types of traditional test cards: cantilever probe and vertical probe. The cantilever probe uses a transverse cantilever to provide proper longitudinal di...

AI Technical Summary

Problems solved by technology

However, in order to electrically connect the signal contacts 133 in the signal ring area 131 with the terminals 143 in the outer ring area 141, the internal circuit 135 must pass through the power ring area 121 (located between the signal ring area 131 and the outer ring area 141); in addition, the internal circuit 135 cannot form an intersection with the power contact 123 (located between the signal ring area 131 and the outer ring area 141), so a corner must be formed to avoid the power contact 123

As such, the length of the internal line 135 increases, causing signal loss problems

In addition, the internal circuit 135 that transmits signals is very close to the power contact 123, and the voltage of the power contact 123 may affect the signal transmitted by the internal circuit 135, causing signal interference

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