Wafer level packaging method for image sensor

Abstract

The invention provides a wafer level packaging method for an image sensor. The packaging method comprises the following steps of: (a) forming a film filter on a glass substrate; (b) cutting the glass substrate so as to obtain separated filtering glass pieces, and detecting the glass substrate or the filtering glass pieces so as to judge whether defects exist in the glass substrate or the filtering glass pieces; (c) and adhering filtering glass pieces with defects smaller than the preset quantity to a light sensing surface of a wafer of the image sensor; and (d) cutting the wafer of the image sensor so as to obtain separated chips of the image sensor.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, and more particularly, to a wafer-level packaging method for an image sensor. Background technique [0002] An image sensor is a sensor that senses external light and converts it into an electrical signal. Image sensors are typically chip-fabricated using semiconductor manufacturing processes. After the image sensor chip is manufactured, a series of packaging processes are performed on the image sensor chip to form a packaged image sensor for use in various electronic devices such as digital cameras and digital video cameras. [0003] figure 1 A package structure of an image sensor is shown. Such as figure 1 As shown, the package structure includes: an image sensor chip 11 , a package glass 12 , a filter glass 13 , an optical lens 14 and a bracket 15 . Wherein, the packaging glass 12 is supported on the side of the photosensitive surface of the image sensor chip 11 by the supp...

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Problems solved by technology

[0005] In addition, the process yield of the image sensor with the additional filter glass 13 is low, which increases its manufacturing cost

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