Operating device for substrate
A technology for working devices and substrates, applied to electrical components, electrical components, etc., can solve problems such as hindering miniaturization and weight reduction, power supply efficiency decline, and cost increase, and achieve miniaturization and weight reduction, cost reduction, and high power supply. The effect of efficiency
Active Publication Date: 2016-12-21
FUJI KK
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Problems solved by technology
[0012] However, in the contactless power supply using a single long and large power supply element as exemplified in Patent Documents 2 and 3, as described above, the power supply efficiency is greatly reduced.
On the other hand, in contactless power supply using a plurality of small power supply elements, a plurality of position detection mechanisms are required, and the cost increases accordingly
In addition, space for arranging multiple position detection mechanisms is required on the fixed side, which hinders miniaturization and weight reduction
Furthermore, since the power supply function of the power supply element is unstable immediately after the power supply is started, if the time to start power supply to the power supply element is delayed with respect to the approach of the moving object, the power supply function may be unstable.
Method used
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Embodiment Construction
[0053] refer to Figure 1~4 The component mounting apparatus 1 of 1st Embodiment equivalent to the board|substrate working apparatus of this invention is demonstrated. figure 1 It is a perspective view which shows the whole structure of the component mounting apparatus of 1st Embodiment. As shown in the figure, the component mounting device 1 is composed of two identical devices arranged adjacently, and one set of devices will be described below. The component mounting apparatus 1 is constituted by assembling a substrate conveyance device 12 , a component supply device 13 , a component transfer device 14 , a component camera 15 , a control computer 16 , and the like on a base 11 . Such as figure 1 As shown by the XYZ coordinate axes on the upper right of the , the horizontal width direction of the component mounting machine 1 (from figure 1 The direction from the upper left to the lower right of the paper surface) is set as the X-axis direction, and the horizontal length di...
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PROBLEM TO BE SOLVED: To provide a work device for a substrate with a non-contact power supply part which contributes to miniaturization and weight saving of the device at a low cost and has a stable power supply function while securing high power supply efficiency as compared to a conventional device.SOLUTION: A head drive mechanism for driving a work head includes: track restriction means (a guide rail 3); non-contact power supplying elements 61-63 installed in a row along the track restriction means 3; selection switches 81-83 which independently switch between conducting and nonconducting of the non-contact power supplying elements 61-63; a movable part 4 which holds the work head and is mounted on the track restriction means 3; a driving device which drives the movable part 4 along the track restriction means 3; a non-contact power receiving element 7 which is provided in the movable part 4, receives power from a part of the non-contact power supplying elements 61-63 and supplies the power to at least the work head or the driving device; and a power supply control part 9 which controls the selection switches 81-83 so as to electrically connect only to the non-contact power supplying element 62 which the non-contact power receiving element 7 approaches.
Description
technical field [0001] The present invention relates to a substrate working device such as a component mounting device and a substrate inspection device that perform predetermined operations for producing a substrate on which a plurality of components are mounted. organization. Background technique [0002] There are solder printing equipment, component mounting equipment, reflow equipment, board inspection equipment, etc. as board working equipment for producing boards on which many components are mounted. Most of these devices are connected by a board transfer device to form a board production line. Among them, the component mounting apparatus generally includes a substrate transfer device for loading and unloading substrates, a component supply device for supplying components, and a component transfer device including a mounting head for mounting components and a head driving mechanism. The head drive mechanism has, for example, a ball screw feed mechanism driven by a se...
Claims
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IPC IPC(8): H05K13/04
Inventor 野村壮志石浦直道神藤高广
Owner FUJI KK