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A method for improving the thickness uniformity of electroplated nickel layer

A layer thickness and electroplating nickel technology, which is applied in the field of improving the uniformity of the thickness of the electroplating nickel layer, can solve the problems of thick edges and thin middle of the electroplating nickel layer, and achieve the effects of reducing the risk of stress, improving uniformity, and reducing costs

Inactive Publication Date: 2017-02-08
THE 41ST INST OF CHINA ELECTRONICS TECH GRP
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Problems solved by technology

[0009] The invention proposes a method for improving the uniformity of the thickness of the electroplating nickel layer, which solves the problem that the middle of the electroplating nickel layer is thin and the edge is thick due to the edge effect of electroplating in the process of electroplating nickel

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  • A method for improving the thickness uniformity of electroplated nickel layer
  • A method for improving the thickness uniformity of electroplated nickel layer
  • A method for improving the thickness uniformity of electroplated nickel layer

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0029] Such as figure 2 As shown, a method for improving the uniformity of the thickness of the electroplated nickel layer of the present invention comprises the following steps: step (a), blasting the surface of the alloy substrate to form a uniform layer of micron-sized particles with different directions on the surface of the alloy substrate Dimples; step (b), degreasing the surface of the alloy substrate; step (c), performing the first water washing operation ...

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Abstract

The invention proposes a method for improving the thickness uniformity of the electroplating nickel layer, which solves the problem that the electroplating nickel layer is thin in the middle and thick at the edge caused by the edge effect of electroplating in the nickel electroplating process. A method for improving the uniformity of the thickness of an electroplated nickel layer, comprising: step (a), blasting the surface of an alloy substrate; step (b), performing an oil removal operation on the surface of the alloy substrate; step (c), spraying the surface of the alloy substrate The first water washing operation is performed on the surface of the alloy substrate; the step (d), the second water washing operation is performed on the surface of the alloy substrate; the step (e), the activation operation is performed on the surface of the alloy substrate; the step (f), the The third water washing operation is performed on the surface of the alloy substrate; step (g), electroplating nickel on the surface of the alloy substrate. A method for improving the thickness uniformity of the electroplated nickel layer of the present invention adds a sandblasting process before the electroplated nickel, thereby improving the uniformity of the thickness of the electroplated nickel layer on the surface of the alloy substrate.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to a method for improving the thickness uniformity of an electroplated nickel layer. Background technique [0002] The uniformity of the thickness of the electroplating metal layer is one of the important indicators to measure the quality of electroplating. In the process of electroplating nickel, due to the "edge effect" of electroplating, the electroplating nickel layer will be thin in the middle and thick at the edge. In order to achieve better transmission performance, microwave integrated circuits need to electroplate a layer of electroplating nickel layer with uniform thickness distribution, and If measures to improve the edge effect of electroplating are not adopted during the nickel plating process of microwave integrated circuits, the edge thickness of microwave integrated circuits will be too thick, and the middle part of microwave integrated circuits will be insufficient in ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/34C25D3/12B24C1/10
Inventor 李华军路波张林昆
Owner THE 41ST INST OF CHINA ELECTRONICS TECH GRP
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