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LED (light-emitting diode) lamp structure and packaging method thereof

An LED lamp structure and LED chip technology, applied in the field of lighting, can solve the problems of difficult to accurately control the thickness and shape of phosphor powder, inconsistent luminous color, low luminous efficiency, etc., so as to improve luminous consistency and luminous efficiency, and improve luminous the effect of uniformity

Inactive Publication Date: 2015-05-20
彩虹奥特姆(湖北)光电有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problems existing in the existing LED lamp structure, such as difficult precise control of phosphor dispensing thickness and shape, inconsistent luminous color, and low luminous efficiency, an embodiment of the present invention provides an LED lamp structure and a packaging method thereof. The technical solution is as follows:

Method used

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  • LED (light-emitting diode) lamp structure and packaging method thereof
  • LED (light-emitting diode) lamp structure and packaging method thereof
  • LED (light-emitting diode) lamp structure and packaging method thereof

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Embodiment 1

[0032] Such as figure 1 As shown, the embodiment of the present invention provides an LED lamp structure, and the LED lamp structure includes a substrate 1 , an LED chip 2 , a reflective cup 3 and an encapsulant 4 . Wherein, at least one reflective cup 3 is fixed on the substrate 1, and at least one LED chip 2 is installed in each reflective cup 3, and the packaging glue 4 is filled in the reflective cup 3 and covers the LED chip 2. The LED lamp structure also includes a sealing Covering the fly-eye lens 6 of the reflector cup 3 , the back of the fly-eye lens 6 is fixed on the upper surface of the encapsulant 4 , and the back of the fly-eye lens 6 is coated with phosphor 7 .

[0033] Specifically, the aforementioned fluorescent powder is mixed with absolute alcohol and coated on the back of the fly-eye lens by spraying. The thickness of the phosphor powder in the embodiment of the present invention can be controlled by spraying time and / or spraying pressure, that is, the thic...

Embodiment 2

[0036] In order to facilitate the understanding of this embodiment, the following combination Figure 1-6 Briefly introduce the structure of the LED lamp provided in this embodiment. Such as figure 1 with figure 2 As shown, the LED lamp structure provided by the embodiment of the present invention includes a substrate 1 , an LED chip 2 , a reflective cup 3 , an encapsulant 4 , a dam 5 and a fly-eye lens 6 . Wherein, at least one reflective cup 3 is fixed on the substrate 1, and a dam 5 is arranged on the substrate 1, and the dam 5 surrounds all the reflective cups 3 around the reflective cup 3, and at least one LED chip is installed in each reflective cup 3 2. The encapsulant 4 is filled in the reflector 3 and covers the LED chip 2 , the back of the fly-eye lens 6 is fixed on the upper surface of the encapsulant 4 , and the back of the fly-eye lens 6 is coated with phosphor 7 .

[0037] Specifically, the aforementioned fluorescent powder 7 is mixed with absolute alcohol an...

Embodiment 3

[0050] An embodiment of the present invention provides a packaging method for the LED lamp structure provided in Embodiments 1 and 2, such as Figure 7 As shown, the encapsulation method includes:

[0051] 301. Evenly disperse the phosphor powder in absolute alcohol, spray the mixture of phosphor powder and absolute alcohol evenly on the back of the fly-eye lens, and then dry it at 80-110°C until all the alcohol volatilizes. Can. The thickness of the phosphor in the embodiment of the present invention can be controlled by spraying time and / or spraying pressure.

[0052] Wherein, the back of the fly-eye lens in the embodiment of the present invention is a planar structure and the front of the fly-eye lens is composed of a plurality of similar miniature curved surface lenses, and the miniature fly-eye lens can be circular, elliptical or parallelogram.

[0053] Preferably, the drying temperature in the embodiment of the present invention is 100°C.

[0054] 302. Installing the ...

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Abstract

The invention discloses an LED (light-emitting diode) lamp structure and a packaging method thereof, which belong to the technical field of illumination. The structure comprises a substrate, at least one LED chip, at least one reflecting cup, packaging glue and a fly-eye lens for sealing the reflecting cup, wherein the at least one reflecting cup is fixed on the substrate; the at least one LED chip is arranged inside each reflecting cup; the packaging glue is filled inside each reflecting cup and covers the LED chips; and the back surface of the fly-eye lens is fixed at the upper surface of the packaging glue, and is coated with fluorescent powder. The LED lamp structure disclosed by the embodiment of the invention separates the chip from the fluorescent powder, and the fly-eye lens, the back of which is coated with the fluorescent powder, is has away from the chip in a certain distance, therefore, the luminous consistency and the luminous efficiency of the LED are improved. Meanwhile, the thickness and the evenness of the fluorescent powder are controlled in a manner of mixing the fluorescent powder with absolute alcohol and then spraying the fluorescent powder on the back of the fly-eye lens, and thus the luminous uniformity of the fluorescent powder is also improved.

Description

technical field [0001] The invention belongs to the technical field of lighting, and in particular relates to an LED lamp structure and a packaging method thereof. Background technique [0002] LED (Light Emitting Diode, light-emitting diode) has many advantages such as small size, long life, energy saving, environmental protection, and fast response speed, and is widely used in instrument indicator lights, instrument backlights, automotive lights and other fields. [0003] The prior art generally adopts a flat-arranged LED lamp structure, including a substrate, LED chips, packaging glue, reflective cups and lenses; multiple reflective cups are fixed on the substrate, at least one LED chip is installed in the reflective cup, and the packaging glue and fluorescent The powder mixture is dotted on top of the LED chip, and the lens is fixed on top of the reflector cup. [0004] In the process of realizing the present invention, the inventor found that the prior art has at leas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/50H01L33/58
Inventor 马建设贺丽云胡杰徐红英苏萍刘彤
Owner 彩虹奥特姆(湖北)光电有限公司
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