Unlock instant, AI-driven research and patent intelligence for your innovation.

Substrate processing equipment

A substrate processing device and substrate technology, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of low exhaust efficiency, increased volume, unstable flow, etc.

Inactive Publication Date: 2016-12-21
DMS CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the substrate processing apparatus of the prior art, since an additional suction device is provided between the plurality of conveying rollers, the volume of the container has to be increased, so all the containers contained in the container The capacity of the treatment liquid will increase
[0007] In addition, an additional suction device formed with hole-type suction openings needs to be provided between a plurality of rollers, and a connecting pipe for connecting the suction device needs to be provided, so there is a problem for discharging in the surface treatment process of the substrate. The problem that the exhaust structure of the generated fume and the droplet of the treatment liquid becomes complicated
[0008] In particular, for the adsorption opening provided in the form of a hole, the smoke and liquid droplets that are not located near the adsorption opening will not be sucked by the adsorption opening, so the exhaust efficiency is low.
[0009] In addition, the adsorption opening of the adsorption device should always be located at a position higher than the water level of the treatment liquid contained in the container, but when a large amount of the treatment liquid passes through a medium pipe arranged at the lower part of the container When being supplied to the inside of the container, since its flow in the inside of the container is not stable, the treatment liquid located between adjacent conveying rollers is shaken, whereby the treatment liquid itself may pass through the Suction openings are sucked causing damage to the blower fan used for suction

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate processing equipment
  • Substrate processing equipment
  • Substrate processing equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] Hereinafter, preferred embodiments of the present invention that can achieve the above objects will be described with reference to the accompanying drawings.

[0049] refer to Figure 1 to Figure 4 , the substrate processing apparatus according to the first embodiment of the present invention includes a plurality of conveying rollers 10, a plurality of chemical solution supply tanks 20, a main container 30, an exhaust unit 50, a front container 110, a rear container 120, a chemical solution supply unit 80, The first chemical solution discharge unit 90 , the drive unit 70 , and the second chemical solution discharge unit 40 .

[0050] The conveying rollers 10 directly contact the lower surface 1 a of the substrate while conveying the substrate 1 , so that the lower surface 1 a of the substrate is wetted by the chemical solution 4 .

[0051] Specifically, the conveying roller 10 includes: a roller body 13 ; and a rotating shaft 11 integrated with the roller body 13 . Th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An apparatus for treating a substrate including a plurality of transfer rollers configured to transfer a substrate and simultaneously to be rotated to wet a back surface of the substrate; a plurality of chemical solution supply tanks configured to receive the chemical solution therein, the plurality of the chemical solution supply tanks arranged under the plurality of the transfer rollers, respectively, with being spaced apart a predetermined distance from each other; a main tank configured to surround the plurality of the chemical solution supply tanks; and an exhaustion unit configured to suck and exhaust fume generated in the process of wetting the back surface with the chemical solution and liquid drops of the chemical solution.

Description

technical field [0001] The present invention relates to a substrate processing device, in particular to a substrate processing device capable of stably performing surface treatment on a specific surface of a substrate and reducing the amount of chemical solution used for the substrate surface treatment. Background technique [0002] In general, a developing solution, an etching solution, a stripping solution, a cleaning solution, and the like are supplied to the surface of the substrate for specific purpose surface treatment such as developing, etching, peeling, and cleaning. [0003] In particular, when the treatment liquid is supplied only to a specific surface of the substrate in order to remove the coating applied on the substrate, the surface tension of the treatment liquid is generally used to directly contact the surface of the substrate with the treatment liquid. The way the rollers are contacted and wetted. [0004] This method is described in Korean Patent Publica...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67057H01L21/67086H01L21/67706
Inventor 朴镐胤
Owner DMS CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More