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Splicing method of infrared focal plane detector chips

A detector chip and infrared focal plane technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of low precision, high cost, high risk, etc., and achieve simplified splicing operation steps, improved efficiency and success The effect of increasing the rate and improving the final precision

Active Publication Date: 2014-11-26
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the splicing of infrared detectors is mainly done manually, with high randomness and low precision. The splicing process needs to be optimized
At the same time, the splicing of infrared detectors has the characteristics of irreversibility, high cost, and high risk, and it is difficult to guarantee splicing accuracy and yield

Method used

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  • Splicing method of infrared focal plane detector chips
  • Splicing method of infrared focal plane detector chips

Examples

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Effect test

Embodiment 1

[0027] An embodiment of the present invention provides a method for splicing infrared focal plane detector chips, see figure 1 , the method includes:

[0028] S101. Input all chip marking points;

[0029] S102. Pre-analyze and optimize splicing accuracy, determine the best arrangement and combination mode and optimized position of the chips to be spliced, and determine the target position of the first chip to be spliced;

[0030] This step specifically includes:

[0031] Analyze the discrete errors of the marking points of each chip and the impact of the arrangement and combination of chips on the final splicing accuracy, and optimize the process to predict the inherent accuracy of various arrangement and combination schemes. The optimal arrangement and combination mode and optimized position of all chips are determined with the highest inherent precision, and the optimized position determines the target position of the chip 1 . In the optimization process, it is necessary ...

Embodiment 2

[0048] An embodiment of the present invention provides a splicing method for multispectral infrared focal plane detector components, see figure 2 , the method includes:

[0049] S201. Prepare a plurality of single-spectrum components according to the process described in Example 1, and measure the actual positions of all chip marking points on each component;

[0050] S202. Treat each single-spectrum component as a single chip, and input all marking points;

[0051]S203. Repeat the process described in S102-S106 in Example 1 to complete the splicing of all single-spectrum components (considered as a single chip);

[0052] S204. Measure the actual positions of all the chips on the multispectral component, and calculate the final splicing accuracy of the multispectral component.

[0053] An embodiment of the present invention provides a splicing method for multi-spectral infrared focal plane detector chips. In this method, each single-spectrum component is regarded as a singl...

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Abstract

The invention discloses a splicing method of infrared focal plane detector chips. The splicing method includes: step A, inputting mark points of given amount of chips to be spliced, performing splicing accuracy pre-analysis and optimization, determining the optical permutation and combination mode and optimization positions of the chips to be spliced, and determining a target position a first chip to be spliced; step B, performing splicing process dynamic optimization from a second chip to be spliced. The splicing method determines the optical permutation and combination mode of all chips through the splicing accuracy pre-analysis and optimization, improves inherent accuracy of a splicing scheme, eliminates error accumulation in the splicing process through the splicing process dynamic optimization, greatly improves final accuracy of infrared focal plane detector splicing, simplifies splicing steps through splicing optimization, reduces operation risk, and improves efficiency and success rate.

Description

technical field [0001] The invention relates to the field of optoelectronic technology, in particular to a method for splicing infrared focal plane detector chips. Background technique [0002] The infrared imaging system for spaceflight requires extremely long detection distance, and at the same time requires the imaging system to have a large field of view and high resolution performance, which requires that the infrared focal plane detector for spaceflight must be an ultra-large-scale or ultra-long line detector component. Due to the limitations of materials and process convenience, it is difficult for the current infrared focal plane detectors to meet the needs of aerospace applications in terms of array scale. For this reason, a precise splicing method must be adopted to combine multiple infrared focal plane detector chips into one component for use. On the other hand, space remote sensing requires infrared focal plane detectors to have multi-spectral detection capabil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/98
Inventor 王春生东海杰孟令超鲍哲博
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP