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Continuous plating device

A technology of electroplating device and electroplating tank, which is applied in the direction of electrodes, electrolysis process, electrolysis components, etc. It can solve the problems of reducing the distance between the workpiece and the electrode (the distance between the anode plate, the deterioration of the fluidity of the electroplating solution, and the narrowing of the gap, etc., to achieve distance reduction and resistance. Effects of smaller size and higher current density

Inactive Publication Date: 2016-12-21
ALMEX PE INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in Japanese Patent Laid-Open No. 2006-214006 and Japanese Patent Laid-Open No. 58-6998, since the nozzle is interposed between the workpiece and the electrode (anode plate), the distance between the workpiece and the electrode (anode plate) is reduced. has limits
[0007] If the electrode (anode plate) is brought close to the workpiece, the nozzle and the electrode (anode plate) interfere, or the gap between the nozzle and the electrode (anode plate) becomes narrow, and the fluidity of the plating solution deteriorates

Method used

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Embodiment Construction

[0038]Hereinafter, preferred embodiments of the present invention will be described in detail. In addition, the present embodiment described below does not unduly limit the content of the present invention described in the claims, and not all the configurations described in the present embodiment are necessarily essential to the solution of the present invention.

[0039] 1. Overall structure

[0040] figure 1 It is a sectional view of the continuous electroplating apparatus related to this embodiment, figure 2 is the floor plan. exist figure 1 Among them, the electroplating tank 10 accommodates the workpiece 1 suspended and supported by the conveying jig 20 in the electroplating solution 2 and performs electroplating on the workpiece 1 . The plating tank 10 has a peripheral wall 10A and a bottom wall 10B, and accommodates the plating solution 2 at the liquid level L. As shown in FIG.

[0041] The workpiece 1 is a circuit board or a flexible (flexible) circuit board, etc...

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Abstract

The present invention relates to a continuous electroplating device. The continuous electroplating device has: a plurality of nozzles (30) arranged in the electroplating tank (10) at positions opposite to the plurality of workpieces (1) to spray the electroplating solution to the plurality of workpieces; A plurality of anode electrodes (40) at positions facing the plurality of workpieces to be continuously conveyed are alternately and repeatedly arranged with one and the plurality of nozzles (30) along the conveyance direction (A) in which the plurality of workpieces (1) are continuously conveyed. At least one of the plurality of anode electrodes (40). In addition, the plurality of nozzles ( 30 ) and the plurality of anode electrodes ( 40 ) are arranged in an overlapping positional relationship in a side view viewed from the conveyance direction (A).

Description

[0001] The contents of Japanese Patent Application No. 2011-214302 filed on September 29, 2011 are included in this application. technical field [0002] The present invention relates to a continuous electroplating device. Background technique [0003] In the continuous electroplating device, an electric field is formed between the workpiece (work) (cathode) that is continuously conveyed and energized in the electroplating tank and the electrode (anode) arranged in the electroplating tank, which is held by the conveying jig and held vertically. The treated surface is electroplated. [0004] Here, as shown in Japanese Patent Laid-Open No. 2000-178784, Japanese Patent Laid-Open No. 2006-214006, and Japanese Patent Laid-Open No. 58-6998, between the workpiece and the electrode (anode plate) is provided with a jetting nozzle to the workpiece. The nozzle of the electroplating solution (nozzle). Therefore, a space at least the diameter of the nozzle is required between the workp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/00C25D5/08
CPCC25D17/10C25D21/10C25D5/08C25D17/12
Inventor 薄田仁志野田朝裕
Owner ALMEX PE INC