Continuous plating device
A technology of electroplating device and electroplating tank, which is applied in the direction of electrodes, electrolysis process, electrolysis components, etc. It can solve the problems of reducing the distance between the workpiece and the electrode (the distance between the anode plate, the deterioration of the fluidity of the electroplating solution, and the narrowing of the gap, etc., to achieve distance reduction and resistance. Effects of smaller size and higher current density
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0038]Hereinafter, preferred embodiments of the present invention will be described in detail. In addition, the present embodiment described below does not unduly limit the content of the present invention described in the claims, and not all the configurations described in the present embodiment are necessarily essential to the solution of the present invention.
[0039] 1. Overall structure
[0040] figure 1 It is a sectional view of the continuous electroplating apparatus related to this embodiment, figure 2 is the floor plan. exist figure 1 Among them, the electroplating tank 10 accommodates the workpiece 1 suspended and supported by the conveying jig 20 in the electroplating solution 2 and performs electroplating on the workpiece 1 . The plating tank 10 has a peripheral wall 10A and a bottom wall 10B, and accommodates the plating solution 2 at the liquid level L. As shown in FIG.
[0041] The workpiece 1 is a circuit board or a flexible (flexible) circuit board, etc...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 