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Multi-material joint recognition method and device based on ultra-broadband phased array layer-by-layer focusing

An identification device and ultra-wideband technology, which is applied in the direction of measuring devices, analyzing materials, and material magnetic variables, can solve problems such as low accuracy, restricting material identification accuracy, and inability to fully reflect the material type of the measured object.

Inactive Publication Date: 2015-09-02
SOUTH CHINA UNIV OF TECH
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AI Technical Summary

Problems solved by technology

[0004] 1. The identification of multi-layer materials cannot be effectively realized, and the quality of the internal materials of the object to be tested cannot be identified
Photothermal identification and color identification only identify surface materials, and the accuracy is not high
The echo feature value extraction regards the object under test as a whole for identification, and cannot distinguish the information of each layer of material
The eddy current method can only identify the material of the upper and lower layers of metal objects.
[0005] 2. The method of echo characteristic value extraction does not fully consider the factors affecting echo characteristics, thus restricting the accuracy of material identification
[0006] 3. The traditional material identification method has fewer measurement points and cannot fully reflect the material types at each position and depth of the measured object
If the measured object is measured at multiple points, the mechanical movement of the launch device is required, which increases the complexity of the equipment and the manufacturing cost

Method used

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  • Multi-material joint recognition method and device based on ultra-broadband phased array layer-by-layer focusing
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  • Multi-material joint recognition method and device based on ultra-broadband phased array layer-by-layer focusing

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Embodiment Construction

[0047] The present invention will be further described in detail below in conjunction with the embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto. In this embodiment, 6 beam sub-arrays are taken as an example, that is, P=6, and an object under test containing N layers of materials is taken as an example, that is, n=1, 2, . . . , N.

[0048] like figure 1 As shown, the device includes an equipment control module, a signal transceiving module, a signal processing module and a curve fitting module.

[0049] The device control module of the device is composed of a central control unit, a data memory, a display device and an operation device. Among them, the central control unit is used to control the work of peripheral devices such as the ultra-wideband signal transceiver module, digital signal processing module, and curve parameter extraction module, as well as data transmission between various modules. The data memor...

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Abstract

The invention discloses a multi-material combined recognition method and a multi-material combined recognition device based on ultra-wideband phased array layer-by-layer focusing. The multi-material combined recognition device based on the ultra-wideband phased array layer-by-layer focusing comprises an equipment control module, a signal transceiving module, a signal processing module and a curve parameter extracting module, wherein the signal transceiving module is connected with the signal processing module; the signal processing module is connected with the curve parameter extracting module; and the signal transceiving module, the signal processing module and the curve parameter extracting module are connected with the equipment control module. The multi-material combined recognition method based on the ultra-wideband phased array layer-by-layer focusing comprises the following step: according to a measured reflection coefficient curve measured value and an intrinsic reflection coefficient experience curve, extracting an electromagnetic parameter of each material layer so as to achieve material recognition. The multi-material combined recognition device based on the ultra-wideband phased array layer-by-layer focusing is simple in structure and has the characteristics of high recognition precision, safety and portability. By the multi-material combined recognition method and the multi-material combined recognition device, an object to be detected can be recognized from multiple sections, multiple angles and multiple depths, and dynamic focusing regulation can be achieved; and the multi-material combined recognition method and the multi-material combined recognition device can be applied to recognition of industrial materials and quality inspection of agricultural products.

Description

technical field [0001] The invention relates to the technical field of material identification, in particular to a multi-material joint identification method and device based on ultra-wideband phased array focusing layer by layer. Background technique [0002] Material identification and quality appraisal are important topics in the field of industrial material quality inspection. For objects composed of multiple materials, the category of each material needs to be identified separately, so as to make a conclusion on the overall material composition and quality identification of the object. For example, how to detect the internal layered structure of an object and the material of each layer, how to identify the authenticity and quality of internal materials such as wood products and metal products, how to identify whether other components are mixed in the material and identify the type of material Wait. [0003] The current common methods for material identification includ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N27/00G01N27/72G01S13/02
Inventor 韦岗陈玉婷曹燕
Owner SOUTH CHINA UNIV OF TECH
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