A processing method for statistical focal plane indium column array height data
A focal plane and height technology, applied in the field of flip welding interconnection, can solve the problems of manual calibration error, difficulty in obtaining specific values and distribution of indium columns, inability to obtain indium column height data distribution, etc.
Active Publication Date: 2015-07-29
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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Since the surface of the indium column is not an ideal plane, it is difficult to obtain the specific value and distribution of the indium column by micrograph observation, and random sampling measurement cannot obtain the complete data distribution of the height of the indium column, and it is easy to introduce errors in manual calibration
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[0061] Below in conjunction with accompanying drawing and embodiment the present invention is described in further detail:
[0062] The data file used in this embodiment is a focal plane sample surface topography height data array with a resolution of 1024×1024 scanned by the OLYMPUS-OLS3000 laser confocal instrument. Laser confocal micrographs of the sample surface topography at the focal plane are shown in figure 2 , figure 2 The circular bright spots in are indium pillars. In this embodiment, 16 scanned data files are analyzed.
[0063] First, analyze the first data file, use Matlab7.0 to import the surface topography height data array Z, generate X and Y coordinate arrays according to the method described in step 1 and step 2 in the manual, and use the mesh() function to generate such as image 3 Surface topography of the infrared focal plane array shown;
[0064] Then, according to the method described in step 3 (set the specified interval Δz to 0.1um) and step 4 in...
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The invention discloses a processing method for collecting focal plane indium column array height data. By means of the method, focal plane surface topography data obtained by a laser scanning confocal microscope is processed according to shape characteristics of a focal plane device indium column, and finally indium column height values of a whole device and collecting distribution of the indium column height values is obtained. The method includes: 1, obtaining a focal plane device surface topography data array and generating a corresponding coordinate array; 2, determining the basic height of indium column height collecting analysis through calculation; 3, separating a height data array of a single indium column; 4, calculating the height of the single indium column; and 5, collecting the height of all indium columns. The processing method has the advantages of being capable of achieving automation of collecting indium column height, and providing data for face-down bonding interconnecting process of a focal plane device; and 2, being objective and correct in collecting results and capable of removing data incompleteness of manual point selecting.
Description
Technical field: [0001] The invention relates to the field of reverse soldering interconnection between an infrared focal plane array and a readout circuit. The automation of the height statistics of the focal plane indium column array is realized, and the problem of data incompleteness existing in manual statistics is solved. Background technique: [0002] Infrared focal plane detectors are increasingly developing in the direction of large area arrays, which greatly increases the difficulty of flip-bonding interconnection, which is a key technology of large-area focal plane devices, and the quality of indium columns ultimately determines whether the flip-bonding interconnection can be of high quality complete. At present, the detection of the height of the indium column generally adopts the method of micrograph observation and random sampling to calculate the average value. These two methods have certain limitations. Since the surface of the indium column is not an ideal...
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IPC IPC(8): G06F19/00
Inventor 华桦周松敏胡晓宁
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI