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Metal coating deposition method and device

A metal and coating technology, applied in the field of devices implementing the method, can solve problems such as expensive

Active Publication Date: 2016-08-03
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method is expensive as components are continuously added to the bath and then removed from the bath and must be disposed of

Method used

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  • Metal coating deposition method and device
  • Metal coating deposition method and device
  • Metal coating deposition method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0061] To treat baths according to the invention, use figure 2 stated in the basis of figure 2 Structure of the chamber filter press 20 device.

[0062] By using a chamber filter press 20, the sludge-like precipitate is separated into a filter cake 93 and a filtrate. The filtrate is returned to the feed bath 10 . By using the method performed according to the invention, the amount of thiourea adhering to the precipitate can be reduced to 103 g / h by pressure filtration. Thus, the amount of thiourea to be added per hour can be reduced by 31% to 457 g / hour. Along with other bath components, there is a cost savings of about 30% in terms of filter cake disposal and simpler recirculation.

Embodiment 3

[0064] To dispose of the bath, use figure 1 described in has image 3 The experimental setup of the first storage tank (sludge tank) 42 of the structure. The sludge tank contains a cooling device 96 operated with cooling water (4° C.), a stirring device 97 and a level sensor 98 . Reference number 95 refers to the line from the settling tank (crystallizer) 18, while reference number 94 refers to the line to the filtration device.

[0065] Cooling with cooling device 96 makes it possible to temporarily store the bath to maintain cooling regardless of the ambient conditions. The sludge content (c (solid)) generated by the settling tank 18 and the residual copper content (c (Cu)) in the bath have temperature dependence. In order to determine the residual copper content and the solid content in the bath, the following experiments were carried out:

[0066] An additional 7 g / l of copper powder (particle size less than 63 microns) was added to 200 l of a bath having the compositi...

Embodiment 4

[0071] In order to determine the copper content of the separated precipitate, the bath used in Example 3 was cooled in a settling tank and the precipitate studied. For this purpose, further treat the precipitate-containing bath in the following different ways to separate the precipitate:

[0072] In a first experiment, the bath was filtered through a suction filter by pressure differential (vacuum applied at the end of the filtrate), whereby a very hard dry filter cake was formed. In a further experiment, a more or less wet precipitate was obtained by pure gravity filtration (comparative experiment). The resulting precipitate was then analyzed for copper content. The experimental results are shown in Table 2. The table also provides the amount of solid matter of the respective separated precipitates in relation to the amount of precipitate in the sample filter cake.

[0073] Table 2: Solid content and copper content in the isolated precipitate

[0074] sample

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PUM

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Abstract

As far as the processing of the bath is simplified, a method for depositing a coating of a first metal on a workpiece 12 exposed to a second metal is proposed, the method comprising the following method steps: a) providing a bath containing bath components liquid 16, the bath composition comprises the ion of the first metal to be deposited, at least one complexing agent for the second metal, and at least one acid, b) the coating of the first metal obtained from the bath 16 layer is deposited onto the workpiece 12, c) feeding the bath 16 into the settling tank 18, d) cooling the bath 16 in the settling tank 18 to produce a precipitate comprising the second metal and at least one complexing agent, and a filtrate , f) returning the filtrate to the bath 16, and g) replenishing the bath 16 with bath components. The method according to the invention is characterized in that, for the separation of the precipitate from the filtrate, a pressure difference is generated through the filter.

Description

technical field [0001] The invention relates to a method for depositing a coating of a first metal onto a second metal of a workpiece, in which the cooling of the bath produces a precipitate which is removed by filtration. Furthermore, the invention relates to a device for carrying out the method. Background technique [0002] In the manufacture of circuit boards, tin and tin alloy coatings are deposited on copper surfaces for various purposes, eg as contact surfaces for electronic components. [0003] First, the tin layer and the tin alloy coating serve as a solder depot on the surface of the circuit board in the area where the electronic components are to be soldered. In these cases, the layer is applied locally in those areas where contact wires or other connecting elements of the component are to be electrically bonded to the copper surface. After the soldering area has been formed on the copper surface, the component is placed on the soldering bank and fastened theret...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/54
CPCC23C18/54C23C18/1617B05C11/00B05D1/18
Inventor H·布鲁克纳A·斯库平C·洛温斯基B·沙赫特纳
Owner ATOTECH DEUT GMBH