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Method for reducing contact resistance based on low-melting-point metal and oxide thereof

A low melting point metal, contact resistance technology, applied in metal/alloy conductors, circuits, connections, etc., can solve the problems of limited electrical conductivity, increased maintenance costs, limited effect of filling conductive paste on the contact interface, etc. The effect of prolonging the service life of equipment and improving the efficiency of power transmission

Active Publication Date: 2014-09-10
郭瑞
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Second, the contact surface will form an oxide film with poor conductivity in the air and adhere to the surface, increasing the resistance
The cost of changing the contact surface material is high, and the performance improvement is small; cleaning the oxide film on the contact surface increases the maintenance cost, and the feasibility is not high; the effect of filling the contact interface with conductive paste is limited. The main reason is that the basic materials of the current conductive paste are all non-metallic. very limited conductivity

Method used

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  • Method for reducing contact resistance based on low-melting-point metal and oxide thereof

Examples

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Effect test

Embodiment 1

[0021] The invention provides a method for reducing contact resistance by using low melting point metal and its oxide. Such as figure 1 As shown, the component consists of fastening screws 1, a mixture of low melting point metals and their oxides 2, two smooth rectangular electrical connectors (that is, metal sheets with screw holes) 3, 4. The size of the electrical connector 3 is 6cm×3cm×1cm; the size of the electrical connector 4 is 6cm×3cm×1cm. The electric connector 3 and the electric connector 4 are made of red copper (in addition, they can also be aluminum or stainless steel); the fastening screw 1 is made of brass.

[0022] The conductive paste (mixture 2 of low melting point metal and its oxide) of the present invention is composed of gallium indium tin alloy and gallium oxide, wherein the mass fraction of gallium oxide is 1%. When in use, evenly coat the mixture 2 of the low melting point metal and its oxide on the contact surface of the metal sheet 3 and make it fu...

Embodiment 2

[0025] The invention provides a method for reducing contact resistance by using low melting point metal and its oxide. Such as figure 1 As shown, the component consists of fastening screws 1, a mixture of low melting point metals and their oxides 2, two smooth rectangular electrical connectors (that is, metal sheets with screw holes) 3, 4. The size of the electrical connector 3 is 10 cm×5 cm×1 cm; the size of the electrical connector 4 is 10 cm×5 cm×1 cm. The electric connector 3 and the electric connector 4 are made of stainless steel (in addition, they can also be aluminum or copper); the fastening screw 1 is made of brass.

[0026] The conductive paste (mixture 2 of low melting point metal and its oxide) of the present invention is composed of gallium indium copper bismuth alloy, gallium oxide and indium oxide, wherein the mass fraction of gallium oxide is 2%, and the mass fraction of indium oxide is 1%. When in use, evenly coat the mixture 2 of the low melting point meta...

Embodiment 3

[0029] The invention provides a method for reducing contact resistance by using low melting point metal and its oxide. Such as figure 1 As shown, the component consists of fastening screws 1, a mixture of low melting point metals and their oxides 2, two smooth rectangular electrical connectors (that is, metal sheets with screw holes) 3, 4. The size of the electrical connector 3 is 8cm×8cm×4cm; the size of the electrical connector 4 is 8cm×8cm×4cm. The electric connector 3 is made of stainless steel, the electric connector 4 is made of red copper; the fastening screw 1 is made of brass.

[0030] The conductive paste (mixture 2 of low melting point metal and its oxide) of the present invention is composed of gallium-tin-silver-copper alloy, gallium oxide and copper oxide, wherein the mass fraction of gallium oxide is 3%, and the mass fraction of copper oxide is 1%. When in use, evenly coat the mixture 2 of the low melting point metal and its oxide on the contact surface of the...

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Abstract

A method for reducing contact resistance based on a metal with a low melting point and an oxide thereof. Conductive paste, i.e. the metal with a low melting point and the oxide thereof are applied between electric connectors which are mechanically connected, wherein the oxide accounts for 0.05-50% of the total weight of the conductive paste; the metal with a low melting point is selected from one of or a combination of any two or more of sodium, potassium, lithium, rubidium, cesium, gallium, indium, mercury, lead bismuth alloy, gallium-base binary alloy, gallium-base complex alloy, indium-base alloy, bismuth-base alloy, mercury-base alloy and sodium-potassium alloy, of which the melting points are lower than 200°C. Using a mixture of the metal with a low melting point and the oxide thereof as a conducting medium, the method can effectively reduce the contact resistance between the metal electric connectors which are mechanically connected, reduce the heat effect of the contact resistance, improve the transmission efficiency of electric energy, and prolong the service life of equipment, and can be applied to the technical field of electric power and energy resources.

Description

technical field [0001] The invention relates to a method for reducing contact resistance, in particular to a method for reducing contact resistance by using low-melting point metals and oxides thereof. Background technique [0002] There are two main reasons for the contact resistance: first, due to the unevenness of the contact surface, the actual contact surface of the metal is reduced, and when the current flows through the conductor, the effective conductive interface of the contact surface is reduced. Second, the contact surface will form a layer of poorly conductive oxide film attached to the surface in the air, increasing the resistance. The size of the contact resistance affects the size of the contact voltage drop, and the voltage drop increases with the increase of the contact resistance, and the change of the voltage directly affects the normal operation of the equipment. The electric energy consumed by the contact resistance will be transformed into heat energy,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R43/00H01B1/02
CPCH01B1/02H01R4/304H01R4/34
Inventor 郭瑞考笑梅钟磊
Owner 郭瑞
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