Dynamic isolation module for semiconductor integration and manufacture production line

Abstract

The invention relates to the design field of integration and manufacture of semiconductors, in particular to a dynamic isolation module for a semiconductor integration and manufacture production line. The invention provides a dynamic isolation module for a semiconductor integration and manufacture production line, the two sides of a casing are provided with an inlet and an outlet, a transmission band passes through the inlet and the outlet, and the inlet and the outlet are respectively provided with a cylinder group for dynamically clamping the transmission band, so the dynamic sealing effect is realized between the casing and the transmission band when the transmission band passes through the casing through the inlet and the outlet. The dynamic isolation module has the advantages that a continuous and dynamic isolation function is realized for a semiconductor substrate; the gas quality in the casing can be controlled in a real-time way in the isolation process; and meanwhile, the modularized design of the isolation process in the semiconductor integration and manufacture production line is realized.

Description

Technical field [0001] The invention relates to the design field of semiconductor production equipment, and in particular to a dynamic isolation module used in a semiconductor integrated manufacturing production line. Background technique [0002] Since the semiconductor integrated manufacturing process needs to be completed step by step by multiple processes, such as cleaning treatment, drying treatment, isolation treatment, PVD coating, etc., and each process step needs to be carried out in a closed environment, the prior art In general, an integrated sealed manufacturing system is used, so that each step of the process is carried out in the same closed environment. In the entire semiconductor integrated manufacturing process, the isolation process is generally between the drying process and the PVD coating. During the PVD coating, it is required to be carried out in a certain vacuum environment. Therefore, the residue contained in the semiconductor substrate after the drying p...

AI Technical Summary

Problems solved by technology

In the prior art, semiconductors are usually prepared in a large-scale integrated hermetic manufacturing system, that is, processes such as cleaning, drying, isolation, and PVD coating are usually carried out in the same airtight environment, which causes differences between the various processes. The interconnected equipment has a complex structure, and it takes a lot of investment to build an integrated sealing manufacturing system

Images