The invention discloses an ultrahigh cleaning process for semiconductor parts, and relates to the technical field of cleaning of semiconductor parts. Comprising the following steps: S1, degreasing and cleaning; s2, filtering and cleaning for the first time; s3, soaking in hot water; s4, soaking in an alkaline etching tank; s5, filtering and cleaning for the second time; s6, soaking in an acid etching tank; s7, filtering and cleaning for the third time; s8, soaking in a pickling tank; s9, filtering and cleaning for the fourth time; s10, performing high-pressure flushing treatment; s11, hot water ultrasonic cleaning; s12, filtering and cleaning for the fifth time; s13, carrying out blow-drying treatment; and S14, high-temperature drying. The ultrasonic degreasing agent tank is arranged for cleaning the aluminum alloy parts, then hot water soaking, alkali etching tank soaking, acid etching tank soaking, high-pressure flushing treatment and hot water ultrasonic cleaning are sequentially carried out, and first-time filtering cleaning, second-time filtering cleaning, third-time filtering cleaning, fourth-time filtering cleaning and fifth-time filtering cleaning are matched; therefore, dust particles, metal ions, oil stains and smudginess of the parts are removed.