Ultrahigh cleaning process for semiconductor parts

A technology for parts and semiconductors, which is applied in the field of ultra-high cleaning process of semiconductor parts, can solve the problems of labor-intensive and time-consuming, complicated and time-consuming operation, and the cleaning effect is not obvious, so as to achieve the effect of improving cleaning efficiency and increasing service life

Pending Publication Date: 2022-03-29
合肥升滕半导体技术有限公司
View PDF8 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the high-demand machines of semiconductors, the accessories used in them are also very demanding on them. Among them, SHOWERHEAD with a CVD process has precise aperture and strict size requirements, and deposits will adhere to it during the process. In order to increase its The service life, manufacturers will carry out repeated cleaning to prolong the service life, the existing parts are laborious and time-consuming in the cleaning process, the cleaning effect is not obvious, the preparation process of the cleaning solution is more troublesome, the whole process is complicated and time-consuming, and the overall effect is not obvious , for this reason, we propose an ultra-high cleaning process for semiconductor parts to solve the above problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultrahigh cleaning process for semiconductor parts
  • Ultrahigh cleaning process for semiconductor parts
  • Ultrahigh cleaning process for semiconductor parts

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Example 1: Please refer to figure 1 As shown, the present invention discloses an ultra-high cleaning process for semiconductor parts, comprising the following steps:

[0035] S1. Degreasing cleaning: Put the required semiconductor aluminum alloy parts into the degreasing agent tank equipped with ultrasonic for degreasing cleaning. The temperature of the cleaning agent in the degreasing agent tank is 45°C, the cleaning time is 3min, and the concentration It is ISOPREP49L 10% v / v, after the cleaning is completed, take it out and spray it with a water gun;

[0036] S2, the first filter cleaning: put the semi-conductor aluminum alloy parts after spray cleaning in step S1 into the clear water pool for filter cleaning, and spray the products taken out after cleaning with a water gun;

[0037] S3. Soaking in hot water: Soak the semiconductor aluminum alloy parts cleaned in step S2 in hot water for 30 minutes and 60° C.;

[0038] S4, Soaking in Alkaline Etching Tank: The semi...

Embodiment 2

[0049] Example 2: Please refer to figure 1 As shown, the present invention discloses an ultra-high cleaning process for semiconductor parts, comprising the following steps:

[0050] S1. Degreasing and cleaning: Put the required semiconductor aluminum alloy parts into the degreasing agent tank equipped with ultrasonic for degreasing and cleaning. It is ISOPREP49L 10% v / v, after the cleaning is completed, take it out and spray it with a water gun;

[0051] S2, the first filter cleaning: put the semi-conductor aluminum alloy parts after spray cleaning in step S1 into the clear water pool for filter cleaning, and spray the products taken out after cleaning with a water gun;

[0052] S3. Soaking in hot water: Soak the semiconductor aluminum alloy parts cleaned in step S2 in hot water for 35 minutes and 65° C.;

[0053] S4, Soaking in Alkaline Etching Tank: Put the semi-conductor aluminum alloy parts soaked in step S3 into an alkali etching tank for immersion, the liquid concentra...

Embodiment 3

[0064] Example 3: Please refer to figure 1 As shown, the present invention discloses an ultra-high cleaning process for semiconductor parts, comprising the following steps:

[0065] S1. Degreasing and cleaning: Put the required semiconductor aluminum alloy parts into the degreasing agent tank equipped with ultrasonic for degreasing and cleaning. It is ISOPREP49L 10% v / v, after the cleaning is completed, take it out and spray it with a water gun;

[0066] S2, the first filter cleaning: put the semi-conductor aluminum alloy parts after spray cleaning in step S1 into the clear water pool for filter cleaning, and spray the products taken out after cleaning with a water gun;

[0067] S3. Soaking in hot water: Soak the semiconductor aluminum alloy parts cleaned in step S2 in hot water for 40 minutes and at a temperature of 70°C;

[0068] S4, Soaking in Alkaline Etching Tank: The semi-conductor aluminum alloy parts soaked in step S3 are put into an alkali etching tank for immersion...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an ultrahigh cleaning process for semiconductor parts, and relates to the technical field of cleaning of semiconductor parts. Comprising the following steps: S1, degreasing and cleaning; s2, filtering and cleaning for the first time; s3, soaking in hot water; s4, soaking in an alkaline etching tank; s5, filtering and cleaning for the second time; s6, soaking in an acid etching tank; s7, filtering and cleaning for the third time; s8, soaking in a pickling tank; s9, filtering and cleaning for the fourth time; s10, performing high-pressure flushing treatment; s11, hot water ultrasonic cleaning; s12, filtering and cleaning for the fifth time; s13, carrying out blow-drying treatment; and S14, high-temperature drying. The ultrasonic degreasing agent tank is arranged for cleaning the aluminum alloy parts, then hot water soaking, alkali etching tank soaking, acid etching tank soaking, high-pressure flushing treatment and hot water ultrasonic cleaning are sequentially carried out, and first-time filtering cleaning, second-time filtering cleaning, third-time filtering cleaning, fourth-time filtering cleaning and fifth-time filtering cleaning are matched; therefore, dust particles, metal ions, oil stains and smudginess of the parts are removed.

Description

technical field [0001] The invention relates to the technical field of cleaning semiconductor parts, in particular to an ultra-high cleaning process for semiconductor parts. Background technique [0002] Semiconductors refer to materials whose conductivity is between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. , no matter from the perspective of technology or economic development, the importance of semiconductors is very huge. The core units of most electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. In addition to the general characteristics of aluminum, aluminum alloys have specific characteristics of some alloys due to the different types and quantities of alloying elements a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67B08B3/02B08B3/08B08B3/12B08B3/14F26B21/00
CPCH01L21/67051H01L21/67057B08B3/02B08B3/08B08B3/12B08B3/14F26B21/00
Inventor 许杰袁林锋张瑞
Owner 合肥升滕半导体技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap