Method for preventing the collapse of high aspect ratio structures during drying
A high aspect ratio, dry technology, applied in the direction of microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve problems such as distortion and collapse
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Embodiment 1
[0089] Blanketed TiN x General method flow for evaluating formulations on (ALD) substrates:
[0090] I. Surface treatment:
[0091] a. Rinse with acetone for 60 seconds
[0092] b. Rinse with IPA for 5 seconds
[0093] c. DI rinse, soak for 1 second; flow DI, 60 seconds
[0094] d. SC1 rinse (1 part NH 4 OH: 1 part H 2 o 2 : 5 copies of DI) 60 seconds
[0095] e. DI rinse, soak for 1 second; flow DI, 60 seconds
[0096] f. Dilute BOE wash (6 parts DI: 1 part BOE) for 60 seconds
[0097] g. DI rinse, soak for 1 second; flow DI, 60 seconds
[0098] II. Surface modification
[0099] a. Put 2×2cm TiN x Test strips (ALD) were fully immersed for 300 seconds at room temperature in a beaker or F20 pan containing the following formulation
[0100] b. DI rinse, soak for 1 second; flow DI, 60 seconds
[0101] III. Drying and measuring contact angle
[0102] a. Spin and dry on Laurel tool or on N 2 medium dry
[0103] b. Measurement of the contact angle of DI water on the ...
Embodiment 2
[0131] A general method flow for evaluating formulations on blanketed Ru(ALD) substrates is shown in image 3 .
[0132] Additional formulations were prepared.
[0133] Formulation AA: 0.5 wt% ODPA, 0.05 wt% defoamer A RD28, 99.45 wt% TPGME.
[0134] Formulation BB: 1.0 wt% dimethyldioctadecylammonium chloride, 0.1 wt% antifoam A RD28, 98.9 wt% DPGME.
[0135] Formulation CC: 1.0% by weight bis(hydrogenated tallow alkyl) dimethyl chloride, 0.1% by weight antifoam A RD28, 98.9% by weight TPGME.
[0136] The contact angle of each Ru wafer was measured at four different times: (a) upon receipt, (b) after pretreatment steps I, II and III, (c) after pretreatment I, II and III, soaking in In the respective formulations and after a 10 min DI rinse, and (d) after pretreatment I, II and III, soaking in the respective formulations, a 10 min DI rinse, and again at room temperature for 36 hours. The results are shown in Figure 4 .
Embodiment 3
[0138] A general method flow for evaluating formulations on blanketed polysilicon substrates using the F20 experiment is shown in Figure 5 .
[0139]
[0140] DMDODAC = dimethyl dioctadecyl ammonium chloride
[0141]
[0142] The contact angle of each polysilicon wafer was measured after pretreatments I, II and III, 5 minutes soaking in the respective formulations, and 10 minutes DI rinse. The results are shown in Figure 6a and Figure 6b .
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