Method of dispersing components into jig and dispersing components into circuit board
A technology for circuit boards and components, applied in the field of components scattered into fixtures, can solve the problems of large manufacturing costs, large labor and time costs, and achieve the effect of saving costs and reducing costs.
Active Publication Date: 2015-08-12
TRIPOD WUXI ELECTRONICS
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Problems solved by technology
However, when the shape of the accommodating groove and the corresponding component is a rare shape (such as an ellipse), if the automatic punching method is still used, an additional positioning mechanism is required, which will cost a lot of manufacturing cost
[0004] In addition, for the manufacturer, when the number of placed components is quite large, it usually takes a lot of manpower and time to manually place the components one by one in the accommodating slots of the circuit board.
Method used
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[0042] A number of embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some existing conventional structures and elements will be shown in a simple and schematic manner in the drawings.
[0043] figure 1 An exploded view of the component dispersion insertion jig 100 according to an embodiment of the present invention is shown. figure 2 draw figure 1 A partial top view of the assembled components scattered into the jig 100 . see also figure 1 and figure 2 , the components are distributed into the jig 100 , and the application is to distribute multiple components into the circuit board 1...
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The invention discloses a jig for elements being dispersedly imbedded in and a method of dispersedly imbedding the elements in a circuit board. The jig for the elements being dispersedly imbedded in is used for dispersedly imbedding the elements being in a circuit board with containing grooves. The jig for the elements being imbedded in comprises a sieve plate, a baffle and a lower platen. The sieve plate is located above the circuit board and is provided with a first surface, a second surface which is located on the opposite side of the first surface and through holes which penetrate through the first surface and the second surface. The first surface is close to the circuit board. Inclined planes are respectively formed on the parts, close to the openings of the through holes, of the second surface, and the through holes are aligned to the containing grooves. The through holes can contain the elements completely. The baffle is movably arranged between the circuit board and the sieve plate. The lower platen is located above the sieve plate and is provided with lugs to touch the elements on the baffle. When the baffle is drawn out between the circuit board and the sieve plate, the lugs impose pressure on the elements.
Description
technical field [0001] The invention relates to a jig for dispersing and inserting components, in particular to a jig for dispersing and inserting components in a circuit board. Background technique [0002] Generally speaking, during the manufacturing process of circuit boards, specific components (such as magnets or copper blocks) need to be placed in the predetermined accommodation slots of the circuit board, because one accommodation slot usually only needs to accommodate one corresponding Therefore, the components can be placed one by one in the accommodating slots of the circuit board by using automatic equipment or manually, depending on the requirements of the manufacturer. [0003] For example, when the shape of the accommodating groove and the corresponding component is a common circular shape, since the automation equipment of Surface Mount Technology (SMT) is easy to obtain, the component can be picked up and printed directly in an automated way. into the corres...
Claims
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IPC IPC(8): H05K3/30
Inventor 黄柏雄石汉青范字远杨伟雄陈凯翔
Owner TRIPOD WUXI ELECTRONICS