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heat sink

A technology of heat sink and radiator, applied in the direction of cooling/ventilation/heating transformation, can solve the problems of wasting time and increasing installation cost, and achieve the effect of saving man-hours and convenient operation

Inactive Publication Date: 2016-09-07
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when assembling this cooling device, screws need to be installed one by one, which wastes time and increases installation cost

Method used

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Embodiment Construction

[0013] see figure 1 and figure 2 , the heat dissipation device of the present invention is used to dissipate heat from electronic components (not shown) on the circuit board 40, which includes a heat sink 10 attached to the electronic components, carrying the heat sink 10 and fixing it on the circuit board 40 A bracket 20 and four resisting parts 30 extending from the bracket 20 and abutting against the radiator 10 .

[0014] Please also see image 3 and Figure 4 , the bracket 20 is a metal die-casting piece, including a substantially square bottom plate 21 and two longitudinal side plates 23 extending upward from the front and rear sides of the bottom plate 21 . A plurality of hollow mounting posts 25 protrude downward from the edge of the bottom plate 21 for passing through a fixing member (not shown) and cooperating with the circuit board 40 , so as to fix the bracket 20 on the circuit board 40 . Two spaced protrusions 27 protrude from the outer middle of each side pl...

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PUM

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Abstract

A cooling device is used for cooling an electronic component. The cooling device comprises a support in which a through-hole is formed and a cooler which penetrates the through-hole of the support to be fixed on the support and is used for contacting the electronic component. The support is further provided with an abutting pressing component which is abutted against the cooler to enable the cooler to be attached to the electronic component tightly. In the cooling device, the cooler is only needed to be placed on the support and abutted through the abutting pressing component to easily achieve the installation of the cooler and the support. Operation is convenient and working time is saved.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for dissipating heat from heating electronic components. Background technique [0002] Since the internal electronic components of the computer dissipate a large amount of heat during use, the industry usually adopts a heat dissipation device to dissipate heat. A common heat dissipation device includes a heat sink for attaching electronic components and a mounting frame surrounding the heat sink and fixing the heat sink on the circuit board. Several spring screws pass through the radiator and the bracket and cooperate with the bracket to fix the radiator on the bracket. However, when assembling this cooling device, screws need to be installed one by one, which wastes time and increases installation costs. Contents of the invention [0003] In view of this, it is necessary to provide a heat sink that is easy to assemble. [0004] A heat dissipation device...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 黄清白洪锐彣
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD