Heat dissipation module and its configuration method

Abstract

The invention relates to a heat dissipation module and its construction method. The heat dissipation module includes a heat pipe, a plurality of heat dissipation fins, and a plurality of pressing clamps, wherein the heat pipe passes through the opening of each heat dissipation fin and the pressing clamps The through holes of the fins, and the heat dissipation fins and the pressing clips are alternately arranged on the outer tube surface of the heat conduction tube, and each heat dissipation fin has an extension part, which is attached to the outer tube surface of the heat conduction tube. Each pressing clip presses against the extension of an adjacent heat dissipation fin, so that the extension is recessed into the outer surface of the heat pipe, thereby enhancing the heat dissipation performance of the heat dissipation module.

Description

[0001] 【Technical field】 [0002] The present invention relates to a heat dissipation module, in particular to a heat dissipation module composed of heat dissipation fins and heat pipes. [0003] 【Background technique】 [0004] With the continuous development of audio-visual, wireless communication and other technologies, electronic components installed on various interface cards, such as central processing unit (central processing unit, CPU), video graphics array (video graphics array, VGA) chips, graphics chips, etc. The microprocessor and its surrounding memory generate a lot of heat during operation. If the heat cannot be effectively dissipated, the interface card will become unstable when it is running at high speed. Therefore, in the conventional technology, a heat dissipation device is installed on the interface card at a position corresponding to the electronic components to dissipate heat. [0005] The traditional heat dissipation method is to coat a layer of heat-co...

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Problems solved by technology

[0008] However, the junction form of the heat pipe and the cooling fins in the prior art only forms a groove at the edge of each cooling fin, and the heat supply pipe is placed, so the heat pipe is not in close contact with each cooling fin, causing the heat pipe and the cooling fin to The thermal resistance between them is too high, so that the fins cannot be effectively used to help the heat pipe dissipate heat

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