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mems microphone

A technology for microphones and circuit boards, which is applied in the direction of electrostatic transducers, microphones, etc., can solve the problems of MEMS microphones not working normally, shortening the service life of MEMS microphones, and damaging MEMS chips, etc., so as to improve acoustic performance, ensure sound pressure, and prolong use The effect of longevity

Active Publication Date: 2015-10-28
GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The disadvantage of the MEMS microphone with this structure is: because the structure of the MEMS chip is that the diaphragm is on the bottom and the back plate is on the top, there is no shield between the diaphragm and the sound hole, and it is easy to damage the membrane when the airflow entering the sound hole is strong. chip, thus damaging the MEMS chip, resulting in the failure of the MEMS microphone to work normally, and shortening the service life of the MEMS microphone

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Such as figure 1 Shown, a kind of MEMS microphone comprises shell 2 that is made by metal material or circuit board material, and shell 2 is the cylindrical structure that one end is open and one end is closed, and the open end of shell 2 is combined with circuit board 1, and circuit board 1 and shell 2 is the inner side of the circuit board 1, and the center of the circuit board 1 is provided with a first sound hole 11, and the diameter of the first sound hole 11 is 0.25±0.05mm. The inboard of the circuit board 1 positioned in the MEMS chip 3 sound inlet cavity is bonded with a support member 4a, and an airflow buffer chamber 5 is formed between the support member 4a and the circuit board 1, and the airflow buffer chamber 5 prevents the first sound hole 11 from entering The strong airflow directly impacts the diaphragm of the MEMS chip 3, which protects the MEMS chip 3, effectively reduces the probability of the MEMS chip 3 being damaged, and prolongs the service life...

Embodiment 2

[0030] Such as figure 2 As shown, this embodiment is basically the same as Embodiment 1, the difference is:

[0031] A glue overflow groove 7 is provided on the circuit board 1 at the position where the support member 4 a is combined with the circuit board 1 , and the glue overflow groove 7 is located on the outer edge side of the support member 4 a. When the support member 4a is pasted and combined with the circuit board, the excess glue can easily block the sound hole, and the overflow glue groove 7 can collect the excess glue, which effectively solves the problem that the sound hole is easily blocked, and improves the performance of the MEMS microphone. Finished product pass rate.

Embodiment 3

[0033] Such as image 3 As shown, this embodiment is basically the same as Embodiment 1, the difference is:

[0034] The supporting member 4b is a flat plate structure, and is glued and combined with the circuit board 1 . Two second sound holes 41 are provided on the support member 4 b, and the two second sound holes 41 are both located in the orthographic projection of the first sound hole 11 . The airflow generated by the external sound enters the MEMS microphone through the first sound hole 11, and is blocked by the support 4b after entering the first sound hole 11, and is shunted by the second sound hole 41 of the support 4b, and acts on the On the diaphragm of the MEMS chip 3, the conversion of sound and electricity is completed. It also plays a role in blocking and weakening the strong airflow, effectively protecting the MEMS chip.

[0035] Compared with the first embodiment, the assembly of this embodiment is simpler and easier.

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Abstract

The invention discloses an MEMS (Micro-Electromechanical System) microphone and relates to the technical field of electroacoustical products. The MEMS microphone comprises a shell and a circuit board which is integrally combined with the shell. A first sound hole is formed in the circuit board. One side of the circuit board which is combined with the shell is defined to be the internal side of the circuit board. An MEMS chip is arranged at a position corresponding to the first sound hole on the internal side of the circuit board. A supporting piece is arranged on the circuit board in the sound inlet chamber of the MEMS chip. At least two second sound holes are formed in the supporting piece. The diameter of the second sound holes is smaller than the diameter of the first sound hole. An isolating plate which is used for preventing air flows which pass through the second sound holes from interfering with each other is arranged on the supporting piece. The isolating plate is arranged in the sound inlet chamber of the MEMS chip. The MEMS microphone solves the technical problems that the MEMS chip of the MEMS microphone in the prior art is apt to damage, the service life is short and the like. The MEMS microphone has the advantages of long service life, high flexibility, good acoustic performance and the like.

Description

technical field [0001] The invention relates to the technical field of electroacoustic products, in particular to a MEMS microphone. Background technique [0002] With the rapid development of electronic technology, MEMS (micro-electro-mechanical system) microphones have gained popularity due to their small size, easy SMT (surface mount technology) installation, high temperature resistance, good stability, high degree of automation and suitable for mass production. more and more widely used. The MEMS microphone in the prior art usually includes a housing and a circuit board integrated with the housing. The circuit board is provided with a sound hole, and a MEMS chip is provided on the inner side of the circuit board at a position corresponding to the sound hole. The MEMS chip has a structure with the back plate on the top and the diaphragm on the bottom, such as Figure 5 As shown, the base 31 is included, the base 31 is provided with a diaphragm 32, the edge of the diaphra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04
Inventor 王喆王显彬刘诗婧
Owner GOERTEK MICROELECTRONICS CO LTD