Semiconductor-metal coil units and electrical apparatus comprising same

A coil unit, semi-conductor technology, applied in the field of coil components and electrical devices, coil unit, can solve problems such as difficult to obtain viscosity, lack of coil, fragility, etc.

Inactive Publication Date: 2013-07-03
LEVITRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, even when the semiconducting material is applied as a slurry to the metal coil, it is difficult to obtain satisfactory adhe

Method used

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  • Semiconductor-metal coil units and electrical apparatus comprising same
  • Semiconductor-metal coil units and electrical apparatus comprising same
  • Semiconductor-metal coil units and electrical apparatus comprising same

Examples

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Embodiment Construction

[0019] In the following, the invention will be described in the context of representative embodiments, which are not intended to limit the invention in any way.

[0020] As used in this application and the claims, the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. Also, the term "comprising" means "comprising". Further, the term "coupled" includes mechanical and other practical means of coupling or linking elements together, and does not exclude the presence of intermediary elements between coupled elements.

[0021] Neither the matter described nor the methods described herein should be construed as limiting in any way. Rather, the present disclosure is directed to all novel and non-obvious features and aspects of the various disclosed embodiments both alone and in various combinations and subcombinations with each other. The disclosed matters and methods are not limited to any specific aspect or feature or combin...

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Abstract

Coil units are disclosed for use in electrical circuits. An exemplary coil unit comprises a rigid substrate having an electrically non-conductive three-dimensional (3-D) surface. At least one 3-D coil (shaped, for example, as a helical coil) of semiconductor material is formed on the substrate surface. Disposed on the at least one coil of semiconductor material is a 3-D coil of a conductive metal. The coil of conductive metal is situated sufficiently closely to the at least one coil of semiconductor material for the coil of conductive metal to produce Coulombic drag in the at least one coil of semiconductor material when the coils are conductive of low-mass electrons. The semiconductor material can be a photoconductor or other material that has conductive low-mass electrons.

Description

[0001] This application claims priority and benefit to US Provisional Application No. 61 / 410,808, filed November 5, 2010, the entire contents of which are hereby incorporated by reference. technical field [0002] The present disclosure relates in particular to a coil unit comprising at least one 3D coil of semiconductor material and at least one 3D coil of conductive metal. More specifically, the present disclosure relates to a coil unit in which at least a metal coil has a helical configuration extending over one or more helical semiconductor coils or over a plurality of toroidal semiconductor coils. The present disclosure also relates to coil assemblies and electrical devices comprising one or more such coils. Background technique [0003] Many semiconductor materials, including some photoconductive materials, are extremely difficult to form three-dimensional (3D) coils. To fabricate the associated devices, most semiconductor materials are formed into individual layers (...

Claims

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Application Information

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IPC IPC(8): H01L21/02H01L21/62H01L31/18H01F5/02H01L31/0352
CPCH01F5/02H01F41/041
Inventor 威廉·N·巴巴特
Owner LEVITRONICS INC
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