A kind of preparation method of conductor material
A technology of conductor material and purity, applied in the usage of superconductor elements, cable/conductor manufacturing, superconducting/high-conducting conductors, etc., can solve the problems of high cost, low strength, poor wear resistance, etc., to improve electrical conductivity and hardness and hardness, dense molecular structure, and short inter-structure linkages
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Embodiment 1
[0016] The preparation process of the Sukangte material of this embodiment is as follows:
[0017] 1. The copper with a purity of more than 99.99% is heated from 0°C to 1050°C, and the material changes from solid to semi-crystalline and semi-liquid;
[0018] 2. Then add active additives with 1.5% copper weight, and after 35 minutes, the semi-crystalline and semi-liquid microstructure begins to transform into a full liquid state;
[0019] 3. In the liquid state, heat up for another 50 minutes to 1120°C, a new molecular structure is formed, and the long bonds between the molecules in the structure are combined with each other to become the shortest, and the arrangement of the atomic structure changes;
[0020] 4. Then continue to heat up to 1350°C for 1.5 hours, so that the short bonds between the structures are arranged in an orderly manner.
[0021] After 110-130 minutes, the temperature is gradually lowered to normal temperature, and the new crystal structure of Sukant is fo...
Embodiment 2
[0023] The preparation process of the Sukangte material of this embodiment is as follows:
[0024] 1. The copper with a purity of more than 99.99% is heated from 0°C to 1050°C, and the material changes from solid to semi-crystalline and semi-liquid;
[0025] 2. Then add active additives with 1% copper weight, and after 30 minutes, the semi-crystalline and semi-liquid microstructure begins to transform into a full liquid state;
[0026] 3. In the liquid state, heat up for another 70 minutes to 1120 ° C, a new molecular structure is formed, and the long bonds between the molecules in the structure are combined with each other to become the shortest, and the arrangement of the atomic structure changes;
[0027] 4. Then continue to heat up to 1350°C for 1 hour, so that the short bonds between the structures are arranged in an orderly manner.
[0028] After 110-110 minutes, the temperature is gradually lowered to normal temperature, and the new crystal structure of Sukant is forme...
Embodiment 3
[0030] The preparation process of the Sukangte material of this embodiment is as follows:
[0031] 1. The copper with a purity of more than 99.99% is heated from 0°C to 1050°C, and the material changes from solid to semi-crystalline and semi-liquid;
[0032] 2. Then add active additives with 1.3% copper weight, and after 32 minutes, the semi-crystalline and semi-liquid microstructure begins to transform into a full liquid state;
[0033] 3. In the liquid state, heat up for another 60 minutes to 1120°C, a new molecular structure is formed, and the long bonds between the molecules in the structure are combined with each other to become the shortest, and the arrangement of the atomic structure changes;
[0034] 4. Then continue to heat up to 1350°C for 1.2 hours, so that the short bonds between the structures are arranged in an orderly manner.
[0035] After 110-130 minutes, the temperature is gradually lowered to normal temperature, and the new crystal structure of Sukant is fo...
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