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bump bottom protection structure

A technology for protecting structures and bumps, applied in the field of protecting structures at the bottom of bumps, can solve the problems of difficult operation control, excessive side etching, etc., and achieve the effect of reducing side etching and reliable bump packaging structure

Active Publication Date: 2016-04-06
NANTONG FUJITSU MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The existing method is difficult to control the operation, and there is still the problem of excessive side erosion when the cooperation is not good

Method used

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Embodiment Construction

[0014] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Elements and features described in one drawing or one embodiment of the present invention may be combined with elements and features shown in one or more other drawings or embodiments. It should be noted that representation and description of components and processes that are not related to the present invention and known to those of ordinary skill in the art are omitted from the drawings and descriptions for the purpose of clarity. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the ar...

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Abstract

The invention discloses a salient point bottom protection structure which comprises a salient point. Protruding objects are arranged on the periphery of the bottom portion of the salient point, and the materials of the protruding objects are identical to the materials of the salient point. A salient point lower metal layer is arranged on the bottom portion of the salient point, an aluminum layer is arranged on the lower portion of the salient point lower metal layer, and a silicon wafer is arranged on the lower portion of the aluminum layer. Due to the fact that the protruding objects are arranged on the bottom portion of the salient point, the protruding objects have the function of compensation in a wet etching process, the probability of occurrence of lateral erosion is reduced, and therefore a reliable salient point packaging structure is formed.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a bump bottom protection structure. Background technique [0002] In the usual bump processing technology, when the sputtering layer is etched by wet method, the side etching caused by isotropy is always a problem. When the side etching is too large, the chemical solution will attack the aluminum layer at the bottom, resulting in electrical sexual loss. Existing methods reduce the amount of lateral etching through the cooperation of etching equipment and potions. In the existing method, the operation is difficult to control, and there is still the problem of excessive side erosion when the cooperation is not good. Contents of the invention [0003] A brief overview of the invention is given below in order to provide a basic understanding of some aspects of the invention. It should be understood that this summary is not an exhaustive overview of the invention. It is no...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/485H01L21/60
CPCH01L24/11H01L2224/11H01L2924/00012
Inventor 丁万春虞国良
Owner NANTONG FUJITSU MICROELECTRONICS
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