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High-strength packaging building material composite board

A composite material board, high-strength technology, used in synthetic resin layered products, layered products, chemical instruments and methods, etc. Satisfy the problems of packaging and building materials, and achieve excellent compressive strength, cushioning, and balanced bending resistance.

Active Publication Date: 2016-03-30
KENSTONG METAL KUN SHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing packaging and building material composite material board has a large adhesive area and is firmly bonded; however, when subjected to external impact and extrusion, the longitudinal and transverse compressive strength of the packaging and building material composite material board is different, and the adaptability is low , which cannot meet the needs of packaging and building materials well

Method used

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  • High-strength packaging building material composite board
  • High-strength packaging building material composite board
  • High-strength packaging building material composite board

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Embodiment Construction

[0014] The embodiments of the high-strength packaging building material composite board of the present invention will be described in detail below with reference to the accompanying drawings.

[0015] A high-strength packaging building material composite board of the present invention includes a surface layer 1, a bottom layer 2, and a buffer layer 3 arranged between the surface layer and the bottom layer, and several buffer layers are arranged on the upper and lower surfaces of the buffer layer. Blind holes, and the blind holes on the upper surface of the buffer layer and the blind holes on the lower surface of the buffer layer are opposite and distributed at intervals.

[0016] In this embodiment, the diameters of the opening ends of the blind holes on the upper and lower surfaces of the buffer layer are larger than the diameters of the bottom ends; and the axial sections of the blind holes on the upper and lower surfaces of the buffer layer are all in the shape In addition ...

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Abstract

The invention discloses a novel package building material composite material plate with high strength, which comprises a surface layer, a bottom layer and a buffer layer arranged between the surface layer and the bottom layer. The upper surface and the lower surface of the buffer layer are both provided with a plurality of blind holes, the blind holes on the upper surface of the buffer layer and the blind holes on the lower surface of the buffer layer are distributed in opposite directions at intervals, and therefore, air pressure support is contained in the buffer layer, so that the package building material composite material plate can be resistant to bending and torsion force in balance mode in both longitudinal direction and transverse direction, and the building material composite material plate has excellent pressure-resistant strength and buffer performance. In addition, the package building material composite material plate can further be fully recycled, and is environment-friendly and practical.

Description

technical field [0001] The invention relates to the field of packaging building material composite material boards, in particular to a high-strength packaging building material composite material board. Background technique [0002] Existing packaging and building materials composite boards have a large adhesive area and are firmly bonded; however, when subjected to external impact and extrusion, the longitudinal and transverse compressive strengths of packaging and building materials composite boards are different, and the adaptability is low , so that it cannot meet the needs of packaging and building materials very well. Contents of the invention [0003] In order to overcome the above-mentioned defects, the present invention provides a high-strength packaging building material composite material board. The packaging building material composite material board has excellent compressive strength and cushioning performance, and can be fully recycled, which is environmental...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B3/12B32B3/28B32B27/06
Inventor 詹玲郎
Owner KENSTONG METAL KUN SHAN