SMT (Surface Mounting Technology) welding spot image segmentation method

An image segmentation and solder joint technology, applied in image analysis, image data processing, instruments, etc., can solve the problems of neglecting class cohesion, inability to segment, wrong segmentation, etc., to improve segmentation quality, avoid wrong segmentation and inability to split effect

Inactive Publication Date: 2013-08-14
GUILIN UNIV OF ELECTRONIC TECH
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Problems solved by technology

[0003] The maximum inter-class variance method is recognized as a threshold segmentation method with good performance, but this method only considers the inter-class variance and ignores the intra-class cohesion, so it cannot reflect the quality of the classification very well, and there are mis-segmentation and inability to segmentation phenomenon

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  • SMT (Surface Mounting Technology) welding spot image segmentation method
  • SMT (Surface Mounting Technology) welding spot image segmentation method
  • SMT (Surface Mounting Technology) welding spot image segmentation method

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Embodiment Construction

[0030] The present invention will be further described below in conjunction with the embodiments and the accompanying drawings.

[0031] A method for segmenting images of SMT solder joints, comprising the following steps:

[0032] 1. Preprocessing the original solder joint RGB true color image: including the smoothing of the solder joint color image, the conversion of the color space from RGB to HIS, and the sharpening of the solder joint image.

[0033] (1) Smoothing of color images of solder joints:

[0034] The specific form of solder joint color image smoothing is:

[0035] f _ ( x , y ) = 1 N Σ ( x , y ...

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Abstract

The invention discloses an SMT (Surface Mounting Technology) welding spot image segmentation method, which comprises the steps of 1) conducting preprocessing on an original welding spot RGB (Red-Green-Blue) true color image, including smoothing a welding spot color image, converting a color space from RGB to HIS (Hue-Intensity-Saturation) and sharpening a welding spot image; 2) segmenting the component H (Hue) of the welding spot image, including dividing the welding spot image into n sub-images, solving the segmentation threshold lambda k (k is more than or equal to 1 and is less than or equal to n) of each sub-image by adopting an improved maximum between-cluster variance method and respectively segmenting each sub-image according to the segmentation threshold lambda k of each sub-image; 3) segmenting the component I (Intensity) of the welding spot image by adopting a region growing method; 4) conducting image arithmetic operation on the component H and the component I of the welding spot image to obtain an intact welding spot morphological image; and 5) conducting morphological processing to the intact welding spot image to obtain a final segmented image. By using the SMT welding spot image segmentation, the phenomenon that the traditional segmentation method causes mistaken segmentation and cannot conduct segmentation method can be effectively avoided and the segmentation quality of the welding spot image is improved.

Description

technical field [0001] The invention relates to microelectronic packaging and assembly technology, in particular to a method for segmenting images of SMT solder joints. Background technique [0002] Image segmentation is the technology and process of dividing an image into regions with different characteristics and extracting objects of interest. Based on methods such as target expression, feature extraction, and parameter measurement of image segmentation, the original image is converted into a more direct and compact form, making image analysis and understanding possible. Image segmentation is an important problem in image processing and a classic problem in computer vision research. In terms of SMT solder joint image segmentation applied to SMT solder joint quality inspection, the commonly used segmentation method is the threshold segmentation method. The threshold segmentation method mainly includes iteration method, maximum between-class variance (Otsu) method and maxi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00
Inventor 吴兆华周德俭严天祥黄红艳陈小勇范勇
Owner GUILIN UNIV OF ELECTRONIC TECH
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