1results about How to "Avoid inseparable" patented technology

The application relates to a chip pickup device, which comprises a pickup assembly, a detection assembly and a base. The pickup assembly comprises a base, a linear driving part, a buffer block and a pickup part. The pickup part is arranged on the buffer block and is used for picking up a chip. The linear driving part can apply controllable linear pressure to the pickup part through the buffer block towards the chip. The buffer block is slidingly arranged on the base in a direction perpendicular to the base film. The detection assembly comprises a detection gas path and a blocking part. The blocking part is arranged on the buffer block and has an initial position for blocking the detection gas path. When the pickup part contacts the chip, the buffer block is driven by the reaction force of a needle assembly to move a preset distance away from the chip, so as to drive the blocking part to at least partially separate from the detection gas path. The chip pickup device can reduce the probability of damage of the chip when the chip is sucked by the pickup part, and improve the yield and processing efficiency of semiconductor packaging.