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A kind of metamaterial based on ceramic substrate and preparation method thereof

A technology of ceramic substrates and metamaterials, applied in the field of metamaterials, can solve the problems of difficult to meet the types of microstructure processing and low shape accuracy, and achieve the effect of simple manufacturing process and low cost

Active Publication Date: 2018-01-16
KUANG CHI INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although the dielectric constant and dielectric loss can meet the design and application of metamaterials, when making circuits, screen printing technology is often used. The circuit line width printed by this technology is about 70 μm, and the shape accuracy of printing is not high. , it is difficult to meet the increasingly rich types of microstructure processing

Method used

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  • A kind of metamaterial based on ceramic substrate and preparation method thereof
  • A kind of metamaterial based on ceramic substrate and preparation method thereof
  • A kind of metamaterial based on ceramic substrate and preparation method thereof

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preparation example Construction

[0029] The preparation method of the metamaterial based on the ceramic substrate of the present invention comprises the following steps:

[0030] a. Preparation of raw porcelain tape: After grinding the low-temperature sintered ceramic powder for 4-24 hours, mix 40-60 parts of low-temperature sintered ceramic powder, 50-30 parts of solvent and 50-30 parts of binder according to the weight component ratio 1. Mix uniformly to form a ceramic slurry, the prepared ceramic slurry is a fluid substance with a certain viscosity, and the ceramic slurry is made into a green ceramic tape by casting method;

[0031] b. Cover the metal film on the green ceramic belt coated with the adhesive 2, and dry it and keep it dry; the metal film can be copper foil, gold foil, silver foil or aluminum foil;

[0032] c. Etching positioning marks on the green ceramic tape covered with metal film;

[0033] d. Etching microstructure patterns on the metal film by etching technology;

[0034] Apply a layer...

Embodiment 1

[0041] Embodiment one: if figure 1 shown

[0042] a. Preparation of green ceramic tape: BiNbO 4 After grinding 0.5wt% Cu powder for 5 hours, the ground 40 parts of BiNbO 4 -0.5wt% Cu powder, 50 parts of ethanol solvent and 5 parts of polyvinyl alcohol are mixed uniformly to form a ceramic slurry, BiNbO 4 -0.5wt% Cu powder is used as the ceramic matrix material, polyvinyl alcohol is used as the binder, and the prepared ceramic slurry is a fluid substance with a certain viscosity, and the ceramic slurry is made into a green ceramic tape by casting method;

[0043] b. Cover the copper foil on the raw ceramic belt coated with polyvinyl alcohol adhesive, and dry it and keep it dry. The adhesive used can be the same as the adhesive used to prepare the ceramic slurry Agent also can be other binding agent, as carboxymethyl cellulose; What select for use in the present embodiment is the same binding agent as in step a;

[0044] c. Etching positioning marks on the green porcelain ta...

Embodiment 2

[0048] Embodiment two: if figure 2 shown

[0049] a. Preparation of green ceramic tape: BaTi 4 o 9 -1.5wt% BaCu(B 2 o 5 ) powder after grinding for 9 hours, the BaTi of 45 parts will be ground by weight component ratio 4 o 9 -1.5wt% BaCu(B 2 o 5 ) powder, 50 parts of ethanol and 7 parts of starch are mixed evenly to form ceramic slurry, BaTi 4 o 9 -1.5wt% BaCu(B 2 o 5 ) powder as a ceramic matrix material, starch as a binder, and the prepared ceramic slurry is a fluid substance with a certain viscosity, and the ceramic slurry is made into a raw porcelain tape by casting method;

[0050] b. Cover the copper foil on the raw ceramic belt coated with polyvinyl alcohol adhesive, and dry it and keep it dry. The adhesive used can be the same as the adhesive used to prepare the ceramic slurry Agent also can be other binding agent, as carboxymethyl cellulose; What select for use in the present embodiment is the same binding agent as in step a;

[0051] c. Etching position...

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Abstract

The invention provides a metamaterial based on ceramic substrates and a preparation method of the metamaterial. The low temperature co-fired ceramic technique and the etching technique are combined so that the metamaterial which is compact and integrated and is based on the ceramic substrates can be obtained, wherein adopted ceramic powder is low temperature sintering ceramic powder, the prepared ceramic substrates do not need other materials to be bonded, combination of the multiple layers of the ceramic substrates which are sintered finally is the same as combination of the inner portions of ceramic, and neither the dielectric constant of the ceramic nor the microstructure of metal can be affected. The metamaterial is simple in manufacturing technique, low in cost and is suitable for large-scale application of multi-layers of metamaterials.

Description

【Technical field】 [0001] The invention relates to the field of metamaterials, in particular to a metamaterial based on a ceramic substrate and a preparation method thereof. 【Background technique】 [0002] The current method of making ceramic substrate metamaterials is: select a glass cloth resin composite substrate mixed with sintered ceramic powder in the resin base, press copper foil on its surface, and finally etch the microstructure, but the ceramic powder of the substrate in this method is the highest. The content is limited, and the dielectric constant and dielectric loss are not ideal. Another method is to use low temperature co-fired ceramics (LTCC) technology to make multi-layer ceramic substrates. The low-temperature co-fired ceramics technology (LTCC) is to make low-temperature sintered ceramic powder into green ceramic tapes with precise thickness and density. Use laser drilling, micro-hole grouting, precision conductor paste printing and other processes to prod...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48C04B35/622
Inventor 刘若鹏赵治亚金曦熊晓磊
Owner KUANG CHI INST OF ADVANCED TECH
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