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speaker module

A loudspeaker module and loudspeaker technology, applied in the direction of the transducer shell/cabinet/bracket, etc., can solve the problems of limiting the size of acoustic components, affecting the improvement and optimization of the acoustic performance of the speaker module, and increasing the difficulty of mold opening, etc., to achieve Acoustic performance improvement, increased mold opening difficulty, and the effect of preventing poor contact or open circuit

Active Publication Date: 2017-08-18
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For some speaker modules with limited structural space, the difficulty of mold opening is increased, and the size of the acoustic components is also limited, which affects the improvement and optimization of the acoustic performance of the speaker module

Method used

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Embodiment Construction

[0031] Below in conjunction with accompanying drawing and embodiment, further elaborate the present invention.

[0032] like figure 1 , figure 2 , image 3 and Figure 4 Commonly shown, a loudspeaker module includes a casing, and the casing includes a first casing 10 and a second casing 12 that are integrated, and the cavity surrounded by the first casing 10 and the second casing 12 contains Speaker unit 20. The inner side of the first housing 10 near the position of the loudspeaker unit 20 is provided with two shrapnel slots 100, the two shrapnel slots 100 are arranged alternately and parallel, which effectively utilizes the arc-shaped structure at the edge of the first housing 10 to maximize This makes room for expansion of the acoustic components. Elastic sheets 30 for electrically connecting the speaker unit 20 and the external circuit of the module are respectively inserted into the elastic sheet slots 100 , and the elastic sheets 30 are punched elastic sheets. Com...

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Abstract

The invention discloses a loudspeaker module, which relates to the technical field of electroacoustic products. There is a speaker unit, the first shell is provided with a shrapnel for connecting the loudspeaker unit and the external circuit of the module, and the first housing is provided with a shrapnel slot for fixing the shrapnel; The elastic sheet includes a snap-in part inserted into the slot of the elastic sheet, and the elastic sheet also includes a bent portion that is connected to the snap-in portion at one end and exposed to the second housing and electrically connected to the external circuit of the module at the other end. part; the clamping part is a flat structure. The loudspeaker module of the invention solves the technical problems in the prior art that the manufacturing of the loudspeaker module is difficult and the space for improving the acoustic performance is small. The loudspeaker module of the present invention is easy to assemble, low in mold opening difficulty, large in inner cavity space, contributes to improvement of acoustic performance, and has high stability and reliability.

Description

technical field [0001] The invention relates to the technical field of electroacoustic products, in particular to a loudspeaker module. Background technique [0002] With the rapid development of the electronics industry, portable electronic devices are popular because of their portability, comprehensive functions, and the ability to meet people's needs in various aspects such as Internet access, communication and entertainment. Speaker modules, which are important acoustic components of electronic devices, have also gained popularity a wide range of applications. Since there are various types and structures of portable electronic devices, the structures of speaker modules installed in portable electronic devices are also different. [0003] In general, the electrical connection shrapnel in the speaker module is directly integrated with the casing by injection molding, but for the speaker module with LDS (laser direct structuring) antenna on the casing, it is not suitable t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R1/02
Inventor 伍迪刘磊
Owner GOERTEK INC
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