Multilayer packaging device for flexible substrate

Abstract

The invention provides a multilayer packaging device for a flexible substrate. The technical scheme includes that the multilayer packaging device for the flexible substrate comprises U-shaped packaging heads on two sides of the multilayer packaging device, and the packaging heads on the two sides of the multilayer packaging device can move towards each other. The multilayer packaging device is characterized in that the U-shaped packaging heads are longitudinally arranged in a staggered manner, one end of the U-shaped packaging head on one side of the multilayer packaging device is matched with a groove of the U-shaped packaging head on the other side of the multilayer packaging device. The multilayer packaging device has the advantage that the integral size of the packaged flexible substrate can be effectively reduced.

Description

technical field [0001] The invention relates to the technical field of substrate packaging in the microelectronics industry, in particular to a flexible substrate multilayer packaging device. Background technique [0002] With the development of microelectronics technology and the complexity and diversification of microelectronic processing functions, the integration density of electronic components in the substrate in microelectronics is increasing, which will inevitably increase the volume of microelectronic packages and affect the performance of microelectronic substrates. Packaging and carrying, a flexible electronic technology has been developed in the prior art. The microelectronic substrate adopts a flexible substrate. The flexible substrate not only has the insulation characteristics of the traditional rigid substrate, but also has the characteristics that the rigid substrate does not have, such as flexibility, so that The substrate itself is foldable, which greatly ...

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Problems solved by technology

[0002] With the development of microelectronics technology and the complexity and diversification of microelectronic processing functions, the integration density of electronic components in the substrate in microelectronics is increasing, which will inevitably increase the volume of microelectronic packages and affect the performance of microelectronic substrates. Packaging and carrying, a flexible electronic technology has been developed in the prior art. The microelectronic substrate adopts a flexible substrate. The flexible substrate not only has the insulation characteristics of the traditional rigid substrate, but also has the characteristics that the rigid substrate does not have, such as flexibility, so that The substrate itself is foldable, which greatly reduces the volume of the package after the flexible substrate is packaged, and ensures the packaging and carrying of the microelectronic substrate. However, the bendable and foldable packaging method of the ordinary flexible substrate can only be bent once, so that once bent Encapsulation of flexible substrates can only form an upper and lower two-layer structure, and the volume of the package after the flexible substrate is packaged is relatively large

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