A flexible substrate multilayer packaging device
A technology of packaging devices and flexible substrates, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of reducing the volume of the package, affecting the packaging and carrying of the microelectronic substrate, and the volume of the package is large.
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[0011] See figure 1 , figure 2 As shown, a flexible substrate multilayer packaging device includes U-shaped packaging heads 1-1 and 1-2 on both sides, and the U-shaped packaging heads 1-1 and 1-2 on both sides can move toward each other. Heads 1-1, 1-2 are vertically staggered, the lower end 1-1a of the left U-shaped packaging head 1-1 cooperates with the groove 3 of the right U-shaped packaging head 1-2, and the right U-shaped packaging head 1-2 The upper end 1-2b of the upper end 1-2b of the left U-shaped packaging head 1-2 is matched with the groove 2 of the U-shaped packaging head 1-2 on the right side, and the upper and lower ends of the right U-shaped packaging head 1-2 have different lengths. 2b corresponds to the inner side of the left U-shaped packaging head 1-1, and the arrangement of the U-shaped packaging heads 1-1 and 1-2 on both sides effectively increases the space inside the left U-shaped packaging head 1-1. The utilization rate of the built-in space of the ...
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