Semiconductor device packages and methods

Abstract

Semiconductor devices packages and methods are disclosed. In one embodiment, a package for a semiconductor device includes a substrate and a contact pad disposed on a first surface of the substrate. The contact pad has a first side and a second side opposite the first side. A conductive trace is coupled to the first side of the contact pad, and an extension of the conductive trace is coupled to the second side of the contact pad. A plurality of bond pads is disposed on a second surface of the substrate.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, and more particularly, to a semiconductor device package and a semiconductor device package method. Background technique [0002] Semiconductor devices are used in various electronic applications such as personal computers, cell phones, and digital cameras. Tens or hundreds of integrated circuit (IC) dies are typically fabricated on a single semiconductor wafer. Individual dies are separated by sawing the integrated circuit along singulation lines. The individual dies are then individually packaged, such as in a multi-chip module, or in other types of packaging. [0003] The semiconductor industry continues to increase the integration density of various electronic components (eg, transistors, diodes, resistors, capacitors, etc.) by continuing to reduce the minimum feature size, allowing more components to be integrated into a given area. In some applications, these smaller elect...

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Problems solved by technology

However, if the end product using this IC is dropped by the user, damage to the IC and thus the end product may occur

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