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Method for Automatic Visual Inspection of Wafer Defects

A wafer and defect technology, applied in the field of automatic visual inspection of wafer defects, can solve problems such as the absence of wafers, achieve the effects of improving efficiency, facilitating types and causes, and saving labor costs

Active Publication Date: 2016-04-27
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] It can be seen that there is currently no method for automatic visual inspection of wafers using a wafer edge defect scanning machine

Method used

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  • Method for Automatic Visual Inspection of Wafer Defects
  • Method for Automatic Visual Inspection of Wafer Defects
  • Method for Automatic Visual Inspection of Wafer Defects

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Embodiment Construction

[0045] The invention provides a method for automatic visual inspection of wafer defects, which can be used in processes with technology nodes greater than or equal to 130nm, 90nm, 65 / 55nm, 45 / 40nm, 32 / 28nm, and less than or equal to 22nm; the invention can also be used for Logic, Memory, RF, HV, Analog / Power, MEMS, CIS, Flash, eFlash and other technology platforms.

[0046] The method of the present invention will be described in detail below.

[0047] The method of the present invention starts to be used after the wafer edge defect scanning machine scans and analyzes the wafer edge, that is, when the wafer is about to leave the stage.

[0048] First, if figure 1 As shown, the wafer is rotated at a low speed on the stage of the wafer edge defect scanning machine, and the speed is controlled at 0.5-1r / min. After the wafer is controlled to rotate by one degree, it is kept in a relatively static state for a period of time. for subsequent photographing. While scanning the wafer...

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Abstract

The invention relates to a method for performing automatic visual inspection on a wafer defect. The method comprises the following steps: providing a wafer with a defect on the surface; obtaining a scanogram for the defect on the surface of the wafer; according to the scanogram for the defect, determining the position area corresponding to the defect on the wafer; obtaining an optical photo of the position area corresponding to the defect on the wafer; comparing the optical photo with the scanogram for the defect so as to obtain the morphology of the defect. Through the adoption of the method, optical photos of the upper part, the side edge and the lower part of the wafer can be obtained in real time; compared with the traditional visual inspection method, the method is more accurate and efficient and faster.

Description

technical field [0001] The invention relates to a wafer defect detection method, in particular to a wafer defect automatic visual inspection method. Background technique [0002] With the rapid development of semiconductor manufacturing technology, the structure of semiconductor devices is becoming more and more complex. Therefore, the defect detection of semiconductor devices is becoming more and more important. [0003] The industry mainly uses a wafer edge defect scanning machine to scan wafer edge defects. This machine can scan the upper, side and lower parts of the wafer edge. After scanning each part of the wafer edge, each The defect scanning map (that is, the information map of the crystal edge), and then the defect position is obtained through data calculation and threshold setting. [0004] At present, in the visual inspection after the defect scanning of the wafer, most of the manual visual inspection is adopted, because most of the currently used edge defect sca...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/88
Inventor 郭贤权许向辉顾珍
Owner SHANGHAI HUALI MICROELECTRONICS CORP