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Multi-layer printed wiring board and manufacturing method thereof

A technology for printed circuit boards and manufacturing methods, which is applied in multilayer circuit manufacturing, printed circuit components, etc., can solve problems such as multilayer printed circuit board warping, and achieve the effect of overcoming board warping and improving quality

Active Publication Date: 2013-12-04
NEW FOUNDER HLDG DEV LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a method for making a multilayer printed circuit board and a multilayer printed circuit board, which are used to solve the problem of multilayer printed circuit boards in the prior art due to reasons such as local mixing of high-frequency materials. board warping

Method used

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  • Multi-layer printed wiring board and manufacturing method thereof
  • Multi-layer printed wiring board and manufacturing method thereof
  • Multi-layer printed wiring board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] The invention provides a manufacturing method of a multilayer printed circuit board.

[0043] Such as image 3 As shown, it shows a method for manufacturing a multilayer printed wiring board provided by Embodiment 1 of the present invention, which is applied in the design and production process of a multilayer printed wiring board, so as to control the board problem, the method includes:

[0044] Step 301 , determining the structural difference between two layers of core boards that are symmetrical about the center in terms of layers.

[0045] Step 302, according to the determined structural difference between the two core boards, select the composition of the two insulating laminates adjacent to the two core boards, so that due to the structural difference between the two core boards The stress generated on the finished multilayer printed circuit board can be partially offset or fully offset.

[0046] Step 303 , making a multilayer printed circuit board by using the...

Embodiment 2

[0049] A more detailed embodiment will be used to illustrate the method for manufacturing a multilayer printed circuit board proposed by the present invention.

[0050] Such as Figure 4 As shown, a method for manufacturing a multilayer printed circuit board provided by Embodiment 2 of the present invention is shown, which is applied in the design and production process of a multilayer printed circuit board to control board warping. The method includes:

[0051] Step 401, determine the structural difference between the two layers of core boards that are symmetrical about the center in terms of the number of layers.

[0052] Among them, the core board whose number of layers is symmetrical about the center refers to a core board whose number of layers is symmetrical about the center of the multilayer printed wiring board in the multilayer printed circuit board, for example, for an 8-layer circuit board, its L1 / 2 layer, L3 / 4 layer, L5 / 6 layer, and L7 / 8 layer are core boards, am...

Embodiment 3

[0087] Based on the same or similar ideas as the above-mentioned method embodiments, Embodiment 3 of the present invention provides a multilayer printed circuit board. In this multilayer printed circuit board, if the number of layers is symmetrical with respect to the center If there is a difference between the boards, there are corresponding differences between the two layers of insulating laminates adjacent to the two core boards.

[0088] Among them, for the first core board and the second core board that are symmetrical in number of layers, if the strength of the first core board is greater than the strength of the second core board, the prepreg is selected so that the second core board adjacent to the first core board The strength of an insulating laminate is greater than the strength of a second insulating laminate adjacent to the second core; if the strength of the first core is less than the strength of the second core, the prepreg is selected so that it is compatible w...

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Abstract

The invention discloses a manufacturing method of a multi-layer printed wiring board. The multi-layer printed wiring board comprises core boards and insulation layer plates, wherein the core boards and the insulation layer plates are arranged in a spaced mode. The method includes the steps of firstly, determining the structural difference between the two layers of core boards symmetrical about a point in terms of the layer number of the multi-layer printed wiring board to be manufactured; secondly, conducting selection of the composition of the two layers of insulation layer plates adjacent to the two layers of core boards respectively according to the structural difference between the two layers of core boards; thirdly, manufacturing the multi-layer printed wiring board through the core boards and the selected insulation layer plates. According to the method, the structural difference and the stress difference between the core boards caused by partially-mixed high-frequency materials and the like are balanced through the difference between asymmetrical insulation layers, therefore, the plate warping problem of the multi-layer printed wring board caused by the structural difference and the stress difference is solved, and the quality of the multi-layer printed wiring layer is improved.

Description

technical field [0001] The invention relates to the technical field of multilayer printed circuit boards, in particular to a method for manufacturing a multilayer printed circuit board and the multilayer printed circuit board. Background technique [0002] For the production of multi-layer printed circuit boards, the current industry needs to make a symmetrical design for the configuration structure, that is, the thickness of the upper and lower core boards is the same and the type of prepreg (also known as PP sheet or prepreg) in the corresponding insulating laminate is the same. See below figure 1 Explain the design idea of ​​symmetrical design, in figure 1 shows a circuit board with a total number of circuit layers of n layers, wherein L1 refers to the first circuit layer, Ln refers to the ground n-layer circuit layer, and the layer between the circuit layer and the circuit layer is a core board or an insulating laminate For example, the L1 / 2 layer is the core board betw...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K1/02
Inventor 陈杰标
Owner NEW FOUNDER HLDG DEV LLC