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Semiconductor packaging semi-finished product and semiconductor packaging process

A packaging process and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems affecting product appearance

Active Publication Date: 2010-10-13
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the sealing body 23 of each packaging unit 25 still has a groove 231, which affects the appearance of the product.

Method used

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  • Semiconductor packaging semi-finished product and semiconductor packaging process
  • Semiconductor packaging semi-finished product and semiconductor packaging process
  • Semiconductor packaging semi-finished product and semiconductor packaging process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0072] refer to Figure 4 to Figure 7 , shows a schematic diagram of the first embodiment of the semiconductor packaging process of the present invention. First, refer to Figure 4 , providing a carrying board 31 . The carrier board 31 has several chips 32 , and the chips 32 are electrically connected to the carrier board 31 . In this embodiment, the carrier board 31 is a substrate, and in other applications, the carrier board 31 can also be a lead frame.

[0073] Next, refer to Figure 5 and Figure 6 , forming at least an encapsulant 33 on the carrier board 31 to cover the chips 32 . The sealing body 33 has a main body 331 and a plurality of outer flanges 332 , the outer flanges 332 are located on the periphery of the main body 331 , and the height of the outer flanges 332 is greater than the height of the main body 331 .

[0074]In this embodiment, the encapsulant 33 has four outer flanges 332 respectively located on four sides of the main body 331 , the outer flanges ...

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PUM

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Abstract

The invention discloses a semiconductor packaging semi-finished product and a semiconductor packaging process. The semiconductor packaging semi-finished product comprises a support plate and at least one adhesive body. The adhesive body is arranged on one surface of the support plate and is provided with a body and a plurality of outward flanges arranged at the periphery of the body, and the height of the outward flanges is larger than that of the body. The rigidity of the semiconductor packaging semi-finished product can be improved by using the outward flanges so that the wrapage condition of the semiconductor packaging semi-finished product, caused by different coefficients of thermal expansion of the adhesive body and the support plate, is overcome, and the yield of a packaging monomer is increased.

Description

technical field [0001] The present invention relates to a semiconductor packaging semi-finished product and a semiconductor packaging process. Specifically, it relates to a semiconductor packaging semi-finished product with several outer flange sealing bodies and a semiconductor packaging process for cutting the semi-finished product. Background technique [0002] Referring to FIG. 1 , a schematic cross-sectional view of a first conventional semiconductor package semi-finished product is shown. The first conventional semiconductor package semi-finished product 1 includes a carrier board 11 , a plurality of chips 12 and an encapsulant 13 . The encapsulant 13 is located on a surface of the carrier board 11 to cover the chips 12 . [0003] The disadvantages of this first type of conventional semiconductor package semi-finished product 1 are as follows. When the first conventional semiconductor packaging semi-finished product 1 is performing the molding step, the sealing body ...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/12H01L23/495H01L25/00H01L23/48H01L21/50H01L21/56
CPCH01L24/97H01L2924/15311H01L2924/1815H01L2224/97H01L2224/73265H01L2224/48227H01L2224/32225H01L24/73H01L2924/181
Inventor 郑仁义陈光雄许俊宏
Owner ADVANCED SEMICON ENG INC