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Housing for electronic equipment, housing using the housing, and electronic equipment

A technology for electronic equipment and housings, applied in the field of electronics, can solve problems affecting user comfort and user experience, and achieve the effects of improving impact damage resistance, good operability, and comfortable user experience

Active Publication Date: 2016-08-17
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Furthermore, the existing plastic or metal tablet computer PAD casings are all hard shells, which directly affect the comfort of the user in the handheld use state, and then affect the user experience.

Method used

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  • Housing for electronic equipment, housing using the housing, and electronic equipment
  • Housing for electronic equipment, housing using the housing, and electronic equipment
  • Housing for electronic equipment, housing using the housing, and electronic equipment

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Embodiment Construction

[0034] The core of the present invention is to provide a structurally optimized housing for electronic equipment to effectively balance the anti-drop performance of the housing and the requirement for product miniaturization. The present embodiment will be described in detail below in conjunction with the accompanying drawings.

[0035] Without loss of generality, this article takes the casing of the tablet computer as the main body for description.

[0036] See figure 1 , which is a schematic diagram of the tablet computer in this embodiment. The casing of the tablet computer is provided with functional components such as a main board, a memory, an antenna device and an audio module. It should be understood that all the functional elements not shown above can be implemented by using existing technologies, so details are not described herein.

[0037] Same as the prior art, the casing is provided with the aforementioned functional elements in the internal cavity enclosed by...

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PUM

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Abstract

The invention discloses an electronic device shell which comprises a first shell body and a second shell body. The first shell body is made of rigid materials and a plurality of hollow openings used for dispersing stress are formed in the first shell body. The second shell body is made of elastic materials and the second shell body and the first shell body are attached to each other so that the electronic device shell can be formed. Compared with an existing electronic device shell, the electronic device shell has the advantages that improved design is conducted on the shell in three aspects including the shell structure, material selection and the specific structure and the requirement for the anti-breakage performance and the requirement for product miniaturization of a machine shell can be effectively balanced through structure optimization. On the basis, the invention further provides the machine shell with the electronic device shell and an electronic device with the electronic device shell.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an electronic equipment shell, a shell using the shell, and electronic equipment. Background technique [0002] With the development of science and technology and the improvement of application requirements, miniaturized and integrated electronic products are constantly being introduced. On the basis of the same overall performance, relatively thinner and lighter products directly affect user choices. Therefore, ultra-thin and ultra-light design has become the mainstream design trend of various manufacturers. [0003] In the prior art, the space for ultra-thin and ultra-light design of the internal components of the corresponding electronic equipment is getting smaller and smaller, thus making the external casing of the electronic equipment gradually become the target research and development object of the ultra-thin and ultra-light design of the whole machine. [0004] Taki...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/00
Inventor 喜胜华尚可
Owner LENOVO (BEIJING) LTD